Integrated Laser and AFM Probe for Semiconductor Defect Detection
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Solution Overview
Problem
The challenge in semiconductor device failure analysis is the difficulty in identifying and locating defects, especially in high-density interconnects and complex structures, where traditional SEM-based nano-probing can cause surface charging and damage, and fail to produce clear images for defect detection at lower-level layers.
Innovation Solution
An integrated inspection tool combining an optical thermal laser stimulation unit and an atomic force probe unit, which uses a laser beam to detect 'hotspots' and generate localized heating, while the atomic force probe unit performs close-loop nanoprobing to determine defect locations, achieving high spatial resolution and avoiding the use of high-voltage electron beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high voltage e-beam is used for imaging, then defect detection capability is improved, but surface charging and damage to the DUT occur
Solution Approach 1:
The patent replaces the electron beam imaging system with an optical laser stimulation system combined with atomic force microscopy. The laser provides optical energy to generate thermal effects for defect detection, while the atomic force probe performs mechanical scanning without requiring high voltage electron beams, thereby eliminating surface charging and e-beam damage while maintaining defect detection capability
Solution Approach 2:
The patent changes the fundamental detection parameter from electron beam energy to optical laser energy. By using laser stimulation at specific wavelengths and detecting thermal responses through atomic force microscopy, the system achieves defect detection without the harmful effects of high voltage e-beams, effectively changing the energy type and detection mechanism
2Object-affected harmful factors
If low voltage e-beam is used for imaging, then surface charging and damage are reduced, but image quality becomes unclear
Solution Approach 1:
The patent substitutes the electron beam imaging mechanism with optical laser stimulation and atomic force microscopy. This replacement allows the system to achieve clear defect detection without relying on electron beam energy, thereby avoiding surface charging and damage while maintaining or improving image quality through optical and mechanical detection methods
3Measurement precision
If traditional SEM-based nano-probing is used, then defect detection is possible, but the DUT may be damaged and electrical behavior affected
Solution Approach 1:
The patent replaces the electron beam-based SEM nano-probing system with an integrated optical laser stimulation and atomic force microscopy system. The laser provides optical energy for thermal defect detection, while the atomic force probe performs non-contact or contact mechanical scanning, eliminating the damaging effects of high voltage electron beams on the DUT's electrical behavior and structural integrity
Solution Approach 2:
The patent introduces optical laser energy as an intermediary to stimulate defects and generate detectable thermal signals. This optical intermediary allows defect detection without direct electron beam interaction, thereby protecting the DUT from e-beam damage while maintaining detection capability through thermal and optical response measurement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient fault location and defect detection in semiconductor devices with high spatial resolution, reducing the risk of damage and improving the accuracy of defect identification, thereby enhancing yield and reducing delays in semiconductor device production.
Implementation Method 1
an optical thermal laser stimulation unit for scanning a surface of a device under test
Implementation Method 2
conducting a second scan of the device with the optical laser unit at a specific location determined by the atomic force probe unit to generate localized heating in the device under test
Implementation Method 3
an atomic force probe unit for scanning the surface of the device under test
Data Source
AI summary
The present disclosure is directed to an inspection tool having an integrated optical laser unit and atomic force probe unit with a detector unit. The inspection tool further includes a processor unit that is coupled to the optical laser unit and the atomic force probe unit and performs a fault location analysis for a device under test. In addition, the present disclosure to methods for inspecting a device under test for defects using an inspection tool having an integrated optical laser unit and atomic force probe unit that includes a detector unit.