Semiconductor Laser Aging Before Mounting
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Solution Overview
Problem
Conventional semiconductor laser device manufacturing methods require lengthy aging steps, leading to high costs, low yields, and wasteful component disposal due to variations in drive current, with the aging step occurring after mounting and causing inefficiencies in throughput.
Innovation Solution
A semiconductor laser device manufacturing method that includes a first aging step where a direct current is passed through the semiconductor laser chip at a set temperature higher than storage temperature before mounting, reducing variations and eliminating the need for post-mounting aging, thereby improving yield and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the aging step is performed after mounting the semiconductor laser chip, then the drive current can be stabilized, but the manufacturing time increases significantly (10-20 hours) and throughput decreases
Solution Approach 1:
The patent applies preliminary action by performing the aging step on the semiconductor laser chip before mounting it onto the package. This allows the drive current stabilization to occur during the mounting process itself, eliminating the need for a separate post-mounting aging period and significantly reducing manufacturing time while maintaining reliability
2Reliability
If the aging step is performed after mounting, then drive current variations can be addressed, but nonconforming articles including packages and systems must be discarded, increasing cost and reducing yield
Solution Approach 1:
The patent performs the aging step on the semiconductor laser chip before mounting, allowing inspection and removal of nonconforming chips prior to package assembly. This prevents wasteful disposal of expensive packages and systems, reducing material loss and improving manufacturing yield while ensuring drive current stability
3Reliability
If a lengthy aging step of 10-20 hours is performed after mounting, then drive current stabilization is achieved, but manufacturing cost increases and yield decreases
Solution Approach 1:
The patent performs aging on the semiconductor laser chip before mounting onto the package, integrating the stabilization process into the manufacturing flow. This eliminates the need for a separate 10-20 hour post-mounting aging step, reducing manufacturing cost and improving yield while achieving the same drive current stabilization effect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method stabilizes electrical characteristics, reduces nonconforming articles, and shortens the time required for subsequent aging steps, resulting in high-throughput, low-cost semiconductor laser devices with minimal drive current variations.
Implementation Method 1
a first aging step for passing a direct current through a semiconductor laser chip for a set time period at a set atmospheric temperature not lower than a storage temperature
Implementation Method 2
passing a direct current through a semiconductor laser chip for a set time period at a set atmospheric temperature not lower than a storage temperature
Data Source
AI summary
A semiconductor laser device manufacturing method includes, sequentially, a first aging step S1, a first inspection step S2, a mounting step S3, a second aging step S4 and a second inspection step S5. Since the first aging step S1 on a semiconductor laser chip with a high-temperature direct current conduction is performed before the mounting step S3, threshold current and drive current of the semiconductor laser chip before mounting can be reduced.