Laser Array Heat Sink With Stepped Through-Holes
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Solution Overview
Problem
In laser array illumination systems, achieving optical alignment, sufficient illumination power, and proper device cooling while maintaining a low cost and compact design is challenging, especially when using semiconductor diode lasers and diode-pumped solid state lasers, due to their different characteristics and requirements for individualized designs.
Innovation Solution
A method of assembling a diode-pumped solid state laser module involves a heat sink module with through-holes, thermal conductive medium, and a thermoelectric cooling system, where laser components are bonded and inserted to achieve direct thermal contact with the cooling surface, reducing thermal interference and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individualized designs are used for semiconductor diode lasers and diode-pumped solid state lasers, then the operational stability and heat dissipation are improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The laser array is divided into two separate sub-arrays: a first sub-array of semiconductor diode lasers and a second sub-array of diode-pumped solid state lasers. Each sub-array is independently mounted on the heat sink with its own through-holes and thermal management structure, allowing individualized design optimization while maintaining a unified overall architecture.
Solution Approach 2:
Different regions of the heat sink are designed with different properties: the first region contains through-holes optimized for semiconductor diode lasers with specific thermal conductivity requirements, while the second region contains through-holes optimized for diode-pumped solid state lasers with different thermal and structural requirements. This allows each laser type to operate in its optimal thermal environment.
2Loss of energy
If individualized designs are used for semiconductor diode lasers and diode-pumped solid state lasers, then the heat dissipation efficiency is improved, but the manufacturing cost increases
Solution Approach 1:
Two laser sub-arrays with different thermal requirements are merged into a single heat sink structure. The heat sink integrates through-holes for both semiconductor diode lasers and diode-pumped solid state lasers, sharing common thermal management infrastructure while maintaining individualized heat dissipation paths for each laser type.
Solution Approach 2:
The heat sink is designed as a universal platform that can accommodate both semiconductor diode lasers and diode-pumped solid state lasers. The through-holes and thermal management structure serve multiple functions: providing mechanical support, enabling heat dissipation, and facilitating optical alignment for different laser types within a single integrated component.
3Loss of energy
If through-holes are provided in the heat sink for direct thermal contact, then the heat dissipation is improved, but the structural complexity increases
Solution Approach 1:
The heat dissipation approach transitions from surface-level thermal contact to volumetric thermal management through through-holes that extend through the entire heat sink thickness. This three-dimensional thermal contact architecture allows direct thermal coupling between laser components and the heat sink interior, significantly improving heat dissipation efficiency.
Solution Approach 2:
Thermal conductive medium is introduced as an intermediary substance filling the through-holes in the heat sink. This medium enhances thermal contact between the laser components and the heat sink walls, facilitating efficient heat transfer from the laser active regions to the heat dissipation structures without requiring direct mechanical contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the operational stability and efficiency of the laser module by reducing thermal interference and improving heat dissipation, allowing for a more compact and cost-effective laser array illumination system.
Implementation Method 1
a cooling module, wherein the cooling module includes a cooling surface and a thermoelectric cooling system
Implementation Method 2
partially filling a thermal conductive medium into the first cavity such that the thermal conductive medium is in thermal contact with the cooling surface in the first cavity
Data Source
AI summary
A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.