Laser Diode Array Assembly With Perpendicular Heatsink for High Power Density
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Solution Overview
Problem
Current laser diode arrays are limited by bulky and expansive designs due to inefficient heat dissipation and electrical connections, restricting the density and power of the output beam.
Innovation Solution
A compact laser diode apparatus design featuring a heatsink extending perpendicularly from the emission surface, with electrically isolated terminal blocks and foils that do not exceed 120% of the laser diode array's footprint, allowing for efficient thermal and electrical communication while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple laser diode arrays are arranged in close packed configuration to scale output power, then the power and intensity of output beam is improved, but the overall size and volume of the laser assembly increases making it bulky and expansive
Solution Approach 1:
The patent combines multiple laser diode arrays into a single integrated assembly where arrays are closely packed together. The heatsink structure merges the thermal management function for multiple arrays into a unified system, while electrical terminal blocks consolidate electrical connections. This merging allows multiple arrays to operate together in a compact configuration rather than as separate units, achieving high power output without proportional increase in overall assembly volume.
Solution Approach 2:
The patent transitions from planar arrangement to three-dimensional close-packed configuration of laser diode arrays. By stacking arrays in multiple layers and utilizing vertical space, the design achieves higher power density without increasing the horizontal footprint. The heatsink extends vertically to manage heat from multiple arrays stacked in the third dimension, enabling compact high-power assembly.
2Temperature
If heatsink elements are provided to disperse waste heat from laser diode arrays, then the heat dissipation capability is improved, but the device complexity and structural bulk increases
Solution Approach 1:
The heatsink structure serves multiple functions simultaneously: it provides thermal management for multiple laser diode arrays, acts as a structural support framework, and serves as a mounting platform for electrical terminal blocks. This multi-functionality reduces the need for separate dedicated components, simplifying the overall device structure while maintaining effective heat dissipation capability across the array assembly.
Solution Approach 2:
The patent merges the heatsink design with the overall assembly structure, where the heatsink becomes an integral part of the housing rather than a separate attached component. Electrical terminal blocks are integrated onto the heatsink structure, and multiple arrays share common heatsink elements. This consolidation reduces structural complexity compared to having individual heatsinks for each array.
3Power
If electrical connections and mounting features are provided for laser diode arrays, then the electrical connectivity is improved, but the cross-sectional footprint increases beyond the array footprint
Solution Approach 1:
The patent nests electrical terminal blocks and mounting features within or upon the existing heatsink structure, which itself is integrated with the laser diode array assembly. The terminal blocks are positioned on the heatsink surface or within its structure, utilizing the same spatial envelope. This nesting approach allows electrical connections to be made without requiring additional external space beyond the array footprint, as components are nested within the existing structural framework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a higher density of laser diode arrays in close proximity, enhancing the power and intensity of the output beam without increasing the overall size, thus overcoming the limitations of existing designs.
Implementation Method 1
A heatsink is in thermal communication with the laser diode array at the mounting surface
Implementation Method 2
Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A laser diode apparatus includes a laser diode array having an emission surface and a mounting surface. A heatsink is in thermal communication with the laser diode array at the mounting surface. The heatsink extends perpendicularly away from at least one edge of the emission surface. Positive and negative electrical terminal blocks are in mechanical communication with the heatsink opposite the laser diode array. Electrical foils are in electrical communication with the laser diode array and the positive and negative terminals. The electrical foils extend perpendicularly away from the emission surface. The positive and negative electrical terminal blocks are electrically isolated from the heatsink. A cross-sectional footprint of the heatsink, positive and negative electrical terminal blocks, and electrical foils is not larger than 120% of a cross-sectional footprint of the laser diode array.