Laser Array Assembly With Spare Lasers for Bandwidth Reliability

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Solution Overview

Problem

High-density laser arrays in optoelectronic modules face challenges in maintaining reliability and yield due to manufacturing tolerances and the need for compact designs, where multiple lasers on a chip can lead to failure if one laser fails, reducing bandwidth and increasing complexity.

Innovation Solution

Incorporating a primary laser and a spare laser on a single optoelectronic chip with a multimode interference coupler or directional coupler, which splits and amplifies optical signals, ensuring high power, low cost, and high density while maintaining reliability through integrated optics and quantum well intermixing regions to prevent signal absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple lasers are integrated on a single chip to increase density, then device compactness and bandwidth are improved, but reliability deteriorates because failure of one laser causes entire array failure

Engineering Contradiction:

ImprovebandwidthVSAvoidarray reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The laser array is segmented into multiple independent laser elements (primary lasers and spare lasers) that can be independently controlled and monitored. This segmentation allows individual laser failure without compromising the entire array, as other lasers can continue operating or serve as backups.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Spare lasers are pre-configured and integrated into the array alongside primary lasers before operation begins. These spare lasers remain in standby mode with all necessary optical paths and control mechanisms pre-established, enabling immediate activation upon primary laser failure without requiring additional setup or reconfiguration.

Inventive Principle:

Principle #10Preliminary action

2Quantity of substance

If multiple lasers are integrated on a single chip, then device density is improved, but manufacturing complexity and tolerance requirements worsen

Engineering Contradiction:

Improvelaser densityVSAvoidmanufacturing complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

Multiple laser elements, spare lasers, optical waveguides, couplers, and amplifiers are merged into a single integrated optoelectronic chip. This consolidation reduces the number of discrete components and interconnections, simplifying manufacturing despite the high density of functional elements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The optical infrastructure (waveguides, couplers, amplifiers) is designed to serve multiple laser elements simultaneously and interchangeably. The same optical paths and control mechanisms are used by both primary and spare lasers, reducing the overall complexity of the system compared to having dedicated infrastructure for each laser.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Loss of energy

If quantum well intermixing regions are used in the multimode interference coupler, then signal absorption is prevented and optical transparency is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvesignal absorptionVSAvoidmanufacturing process

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The refractive index parameters of the coupler material are changed by creating quantum well intermixing regions with different compositional gradients. This parameter modification enables wavelength-selective transparency, allowing the coupler to transmit specific laser wavelengths while blocking others, thereby reducing signal absorption and improving optical efficiency.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the reliability and yield of high-density laser arrays by allowing seamless switching between primary and spare lasers, maintaining high power and low cost, and reducing signal loss through passive optical components, thus addressing the challenges of compactness and reliability in optoelectronic modules.

Implementation Method 1

The multimode interference coupler may include a quantum well intermixing region that is transparent to wavelengths of light generated by the laser array

Methodology Applied

Scientific EffectQuantum well intermixing:

Implementation Method 2

annealing to diffuse vacancies in the quantum well and barrier layer

Methodology Applied

Scientific EffectDiffusion: Diffusion

Implementation Method 3

ion implanting the buffer layer

Methodology Applied

Scientific EffectIon implantation: Ion Implantation

Data Source

PatentUS11811198B2High power laser array devices and methods

Publication Date: 2023.11.07 II VI DELAWARE INC

AI summary

In one example, an optoelectronic assembly may include a laser array, an amplifier array, and a multimode interference coupler optically coupling the laser array and the amplifier array. The laser array may include at least one primary laser and at least one spare laser configured to be activated if the primary laser fails. The amplifier array may include at least two amplifiers configured to amplify optical signals received from the laser array.