Compact Laser Assembly with Integrated Thermal Pads
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Solution Overview
Problem
There is a need to reduce the form factor of Integratable Tunable Laser Assemblies (ITLA) while maintaining full functionality, specifically fulfilling the specifications defined in the OIF-ITLA-MSA-01.0 except for mechanical specifications, in the context of optical internetworking technologies.
Innovation Solution
A laser assembly comprising a first and second plate with projections and openings, a printed circuit board assembly with a laser module, and retention screws, where the plates secure the printed circuit board assembly, and thermal pads are used to hold and dissipate heat from the laser module, allowing for a compact design that minimizes the impact on the printed board assembly's area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the form factor of ITLA is reduced, then the device size is minimized, but the functionality and heat dissipation capability may be compromised
Solution Approach 1:
The patent combines multiple functions into the housing structure: mechanical retention of the laser module, thermal conduction path provision, and structural support are all integrated into the housing design. The housing acts simultaneously as a mounting structure and a heat sink, eliminating the need for separate retention and thermal management components.
Solution Approach 2:
The housing is designed to perform multiple functions: it provides mechanical support, retains the laser module through integrated retention features, conducts heat away from the laser module, and serves as the outer protective enclosure. This multi-functionality reduces the overall component count and enables compact form factor while maintaining full functionality.
2Volume of moving object
If the form factor of ITLA is reduced, then the device size is minimized, but the structural stability and retention capability may be compromised
Solution Approach 1:
The retention features are integrated directly into the housing structure rather than being separate components. The housing includes built-in retention mechanisms that securely hold the laser module while maintaining structural integrity, combining the functions of structural support and module retention in a single element.
Solution Approach 2:
The housing is designed with segmented features including separate retention regions, mounting regions, and thermal conduction paths. This segmentation allows each region to be optimized for its specific function while maintaining overall structural stability and enabling compact integration.
3Temperature
If thermal pads are added to hold and dissipate heat, then heat dissipation capability is improved, but the complexity of the assembly increases
Solution Approach 1:
The thermal pads are integrated into the housing structure as built-in thermal conduction paths rather than separate attachable components. The housing includes thermal conduction features that directly contact the laser module, combining the functions of mechanical retention and thermal management in the same structural elements.
Solution Approach 2:
The housing structure itself provides the thermal management function through integrated thermal conduction paths. The housing material and structure are designed to conduct heat away from the laser module without requiring external thermal management systems, making the system self-sufficient for thermal control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-functionality micro ITLA with minimized impact on the printed board assembly area, ensuring reliable non-flexible mounting of the laser module and efficient heat dissipation, thus addressing the form factor reduction requirement.
Implementation Method 1
a first pad 930 provided between the laser module 100 and the first plate 903; and/or a second pad 920 provided between the laser module 100 and the second plate 901, wherein any of the first pad 930 and the second pad 920 is adaptable to be compressed, and adaptable to hold the laser module 100 or to hold the laser module 100 and to dissipate the heat from the laser module 100
Data Source
AI summary
A laser assembly and a method for manufacturing the same are provided according to embodiments of the present disclosure. The laser assembly (900) may comprise a first plate (903) having first projections (918, 928); a printed circuit board assembly (902) including a printed circuit board (912) having first openings (913, 915) and a laser module (100) thereon, and a second plate (901) having second projections (917, 927). The printed circuit board assembly (902) can be retained between the first plate (903) and the second plate (901) by the first projections (918, 928) and the second projections (917, 927). The laser assembly may further comprises a first pad (930) provided between the laser module (100) and the first plate (903) and/or a second pad (920) provided between the laser module (100) and the second plate (901). Any of the first pad (930) and the second pad (920) may be adaptable to be compressed, and adaptable to hold the laser module (100) or to hold the laser module (100) and to dissipate the heat from the laser module (100).