Laser-Assisted Hermetic Encapsulation for Temperature-Sensitive Devices
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Solution Overview
Problem
Conventional hermetic encapsulation techniques, such as thermo-compressive bonding, require high temperatures that can damage temperature-sensitive electronic devices, limiting their application to devices that can withstand thermal processing.
Innovation Solution
A laser-assisted encapsulation method that uses a laser beam to melt and connect substrates at room temperature up to 150°C, employing a low-temperature melting intermediate bonding layer composed of glass particles, metal particles, or composite materials, allowing for a hermetic seal without subjecting the entire device to high thermal steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature bonding is used to achieve hermetic seal, then sealing quality is improved, but device components may be damaged
Solution Approach 1:
The patent segments the heating process by using a laser beam to locally melt only the bonding material at the seal location, while the rest of the device remains at low temperature. This spatial segmentation resolves the contradiction by concentrating thermal energy only where needed for hermetic sealing, preventing thermal damage to temperature-sensitive components elsewhere in the device
Solution Approach 2:
The patent applies local quality by creating a high-temperature zone only at the bonding material interface using laser irradiation, while maintaining low temperature in the bulk device. This localized thermal processing achieves hermetic seal quality without subjecting the entire device to high temperatures that would cause component damage
2Reliability
If conventional thermal bonding is used, then hermetic seal is achieved, but processing time is long
Solution Approach 1:
The patent employs periodic action by using pulsed laser irradiation to melt the bonding material. The laser is applied in controlled pulses that rapidly heat and melt the bonding material on demand, significantly reducing the time required compared to conventional continuous thermal bonding processes that require prolonged heating
Solution Approach 2:
The patent replaces the conventional mechanical/thermal bonding system with a laser-based system. Instead of using broad thermal fields and mechanical pressure over extended periods, the laser beam provides precise, rapid energy delivery that melts the bonding material quickly, reducing processing time while maintaining hermetic seal quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a high-quality hermetic seal with improved long-term stability, reducing processing time and costs, and is suitable for temperature-sensitive devices like PV, OLED, and MEMS, maintaining device integrity and functionality.
Implementation Method 1
a hermetic seal is formed through melting of an intermediate bonding layer by a laser beam
Implementation Method 2
melting of an intermediate bonding layer by a laser beam
Implementation Method 3
At least one of the substrates must be transparent at the wavelength of the laser
Data Source
AI summary
Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emission wavelength of the laser, depositing an intermediate bonding contour layer on one or both of the substrates; depositing electronic device components on one or both of the substrates; joining the first substrate and second substrate with the electronic device components in-between the substrates; using the laser to direct a laser beam onto the intermediate bonding contour layer with a predefined progressive scan pattern, such that the intermediate bonding contour layer is progressively melted and forms a seal, bonding the substrates together. Preferably, each linear laser pass overlaps longitudinally the previous and the following linear laser passes along said contour. Preferably, each linear laser pass is followed by a partial backtrack of the each linear laser pass, such that a part of the linear laser pass overlaps longitudinally the previous linear laser pass.