Laser Base Plate Heat Pipe Layout for Thermal Homogeneity

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Solution Overview

Problem

Existing laser base plates face challenges with temperature stability, deformation, and misalignment of optical components due to thermal gradients, which complicates construction, increases costs, and reduces reliability, especially in large-scale applications.

Innovation Solution

Incorporating passive heat transfer means such as heat pipes or copper rods into a stainless steel laser base plate to enhance thermal conductivity, combined with laser spot welding for precise component attachment, which maintains mechanical integrity and stability while improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If aluminum alloys are used for laser base plate, then thermal conductivity is improved, but temperature stability and dimensional stability deteriorate

Engineering Contradiction:
Improvethermal conductivityVSAvoiddimensional stability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent employs a composite structure consisting of an aluminum alloy base plate combined with invar or kovar components. The aluminum alloy provides high thermal conductivity for effective heat dissipation, while the invar or kovar components provide ultra-low thermal expansion properties for dimensional stability. This composite approach allows the system to simultaneously achieve both thermal management and dimensional stability that neither material could provide alone.

Inventive Principle:
Principle #40Composite materials

2Stability of the object's composition

If invar or kovar alloys are used for laser base plate, then dimensional stability is improved, but thermal conductivity deteriorates

Engineering Contradiction:
Improvedimensional stabilityVSAvoidthermal conductivity
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The patent creates a hybrid structure where invar or kovar components (providing dimensional stability) are integrated with an aluminum alloy base plate (providing thermal conductivity). The invar or kovar elements serve as mounting structures for optical components, while the aluminum base plate acts as a heat sink, thus combining the advantages of both materials while compensating for their individual weaknesses.

Inventive Principle:
Principle #40Composite materials

3Stability of the object's composition

If SiO2 is used for laser base plate, then dimensional stability is improved, but ease of manufacture and welding deteriorate

Engineering Contradiction:
Improvedimensional stabilityVSAvoidwelding difficulty
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent integrates SiO2 components with metal structures, where the SiO2 provides dimensional stability and the metal components (aluminum alloy or stainless steel) provide ease of manufacture and welding. The composite structure allows optical components to be mounted on SiO2 surfaces while mechanical assembly and welding are performed on the metal portions, thus combining the advantages of both material types.

Inventive Principle:
Principle #40Composite materials

4Temperature

If thermoelectric coolers are used for temperature stabilization, then temperature control is improved, but device complexity and energy consumption deteriorate

Engineering Contradiction:
Improvetemperature controlVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent utilizes the natural high thermal conductivity of aluminum alloy base plates to enable passive heat dissipation and self-stabilization of temperature. The aluminum base plate acts as a heat sink that automatically distributes and dissipates heat from laser components without requiring active cooling systems, thus achieving temperature control while minimizing device complexity and energy consumption.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly reduces temperature gradients, minimizes deformation, and ensures stable optical component positioning, reducing warm-up time and production costs, enhancing the reliability and service life of the laser system.

Implementation Method 1

Incorporating passive heat transfer means such as heat pipes or copper rods into a stainless steel laser base plate to enhance thermal conductivity

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

combined with laser spot welding for precise component attachment

Methodology Applied
Scientific EffectLaser welding: Laser Beam Welding

Data Source

PatentUS20240047931A1Method and device for homogenizing the temperature of a laser base plate
Publication Date: 2024.02.08 LITILIT UAB
  • US20240047931A1 patent drawing
  • US20240047931A1 patent drawing
  • US20240047931A1 patent drawing

AI summary

The invention relates to the field of laser technology, and methods and devices intended for homogenizing the temperature of a laser base plate, where optical component holders are attached to the laser base plate comprising a heat transfer medium. In order to reduce susceptibility of the laser base plate to local temperature differences, ensuring stable positions of the optical components and, consequently, the orientation of the optical paths, the material from which the laser base plate and optical component holders are made is stainless steel. Heat pipes are built into the laser base plate and have a significantly higher thermal conductivity than stainless steel, and their coefficient of thermal expansion is close to the coefficient of thermal expansion of stainless steel. The holders of the optical components are attached and adjusted with respect to each other to said laser base plate by laser spot welding.