Laser Device Beam Clipping for High Power Bundling
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Solution Overview
Problem
Existing laser devices for show laser projection struggle to achieve the highest possible average power with a well-bundled output beam, as existing technologies do not effectively manage beam clipping and diffraction effects to enhance projection quality.
Innovation Solution
The laser device employs a method where individual output beams are clipped to minimize lost intensity, allowing them to be brought closer together without negative diffraction effects, using combining deflection elements and an overall collimator to achieve a well-focused beam with a reduced beam diameter, and independent adjustment of the beams to align energetic rays, optimizing the aspect ratio and divergence of single-emitter laser diodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If individual output beams are clipped at combining deflection elements, then the individual output beams can be brought closer together to improve bundling, but the total usable intensity is reduced
Solution Approach 1:
The patent optimizes the clipping parameters by limiting the cut-off to maximum 20% of total intensity (preferably 10-15%) and configuring the combining deflection elements with specific angles and positions to achieve the optimal balance between beam bundling and intensity retention
Solution Approach 2:
The patent applies partial clipping action where only the peripheral portions of individual beams are cut off rather than the entire beam, allowing sufficient bundling improvement while retaining the majority (80%+) of usable intensity
2Shape
If individual output beams are clipped, then beam bundling is improved, but diffraction effects are expected to deteriorate projection quality
Solution Approach 1:
The patent converts the potentially harmful diffraction effects from beam clipping into beneficial outcomes by using the clipped beam configuration to achieve superior overall bundling and projection quality, where the diffraction from controlled clipping edges creates acceptable interference patterns that do not degrade image quality
Solution Approach 2:
The patent controls diffraction effects by optimizing clipping parameters (maximum 20% intensity cut-off) and using specific beam combination geometries that minimize negative diffraction while maintaining bundling improvements
3Area of stationary object
If the beam diameter is reduced for better projection, then the 1/e bundle cross-section is narrowed, but the beam power is reduced
Solution Approach 1:
The patent segments the beam reduction process into multiple stages: individual beam clipping at combining elements, group beam array formation with controlled cross-section (1/e ≤ 8mm, preferably ≤ 6mm), and final superposition of multiple group beam arrays, allowing progressive diameter reduction while accumulating power from multiple laser diodes
Solution Approach 2:
The patent merges outputs from multiple single-emitter laser diodes (each contributing to the reduced cross-section beam) to achieve high power density in the final narrow beam, where the combined power of multiple diodes is concentrated into a small 1/e cross-section
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a well-focused overall output beam with improved bundling and projection quality, maintaining over 90% usable intensity while reducing the beam cross-section, enhancing the clarity and contrast of projected images.
Implementation Method 1
combining deflection elements (10a to 18) for superimposing the individual output beams (3)
Implementation Method 2
overall collimator (21 to 28) for reducing the beam diameter of the overall output beam (4)
Implementation Method 3
deflection mirrors (10 to 18) adjusted according to claim 5 bring about a further narrowing of the overall output beam
Data Source
Figure 1~2
Figure 3~9
AI summary
The device (1) has a collimator (7) for grouping input-output radiations (3) attached to each of single emitter laser diodes (2). The radiations of a single emitter laser diodes group (8) are combined together to radiation-array-groups (20, 23) by combined-tilted mirrors (10b-10d, 14, 18). Non-reflected input-output radiations are combined together with reflected input-output radiations from the mirrors. A part of the non-reflected input-output radiations and a part of the reflected input-output radiations are truncated at the mirrors, and do not contributed to the radiation-array-groups.