Laser Beam Clipping for Wide Power Density Control in Evaporation
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Solution Overview
Problem
Existing laser systems struggle to provide a wide range of power densities for heating and evaporating or sublimating targets in evaporation systems, particularly in thermal laser epitaxy, due to their abrupt threshold and limited dynamical range, which can lead to thermal strain and substrate failure when using pulse width modulation.
Innovation Solution
A method and system that adjusts the laser beam's power and cross section using a clipping aperture and multiple adjusting sections to achieve a dynamical range of power densities up to 1000 or more, allowing for precise control of power density by altering the laser beam's cross section and clipping aperture size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If pulse width modulation is used to adjust time-averaged power, then power control range is improved, but thermal strain and substrate failure occur
Solution Approach 1:
The patent divides the power adjustment function into two independent sections: a first adjusting section that handles coarse power level changes and a second adjusting section that handles fine power level changes. This segmentation allows continuous power adjustment without the thermal shock caused by pulse width modulation, as each section operates independently to provide smooth transitions. The clipping aperture further segments the beam path to enable precise control of the intermediate power level, eliminating the harmful time-varying signals that cause substrate failure.
Solution Approach 2:
The patent introduces a clipping aperture as an intermediary element between the two adjusting sections. This intermediary component creates an intermediate power level that serves as a bridge between high and low power states, allowing smooth transitions without abrupt changes. The clipping aperture mediates the power adjustment process by selectively blocking portions of the beam, thereby eliminating the thermal strain caused by direct pulse width modulation while maintaining continuous power control capability.
2Adaptability or versatility
If laser intensity is reduced below threshold, then power density control is improved, but laser turns on abruptly at threshold causing limited dynamical range
Solution Approach 1:
The patent segments the power adjustment range into two distinct sections: a first adjusting section for coarse adjustment covering the full dynamical range from maximum power down to the threshold region, and a second adjusting section for fine adjustment that takes over near the threshold to provide precise control. This segmentation allows the system to operate smoothly across the entire dynamical range without abrupt transitions, as each section is optimized for its specific power range and can independently control the beam parameters without being constrained by the laser's threshold behavior.
3Adaptability or versatility
If beam cross section is adjusted to change power density, then power density range is improved, but additional beam adjusting sections are required increasing device complexity
Solution Approach 1:
The patent divides the beam adjusting means into two independent adjusting sections, each capable of adjusting the beam cross section. This segmentation allows each section to operate within a specific power range and make targeted adjustments, thereby achieving a wide overall power density range without requiring a single complex adjusting mechanism. The first adjusting section handles coarse beam size changes for high power levels, while the second adjusting section handles fine beam size changes for low power levels, simplifying the control logic and reducing the complexity of any single adjusting component.
Solution Approach 2:
The patent implements dynamic switching between the two adjusting sections based on the current power level. The system automatically activates the appropriate adjusting section depending on whether the operating point is in the high-power or low-power regime, allowing the beam cross section to be dynamically adjusted across the full range. This dynamic operation enables wide power density control while keeping each individual adjusting section relatively simple, as each is only responsible for a specific portion of the overall adjustment range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a wide range of power densities, from lowest to highest, reducing thermal strain and substrate failure, and allowing for efficient heating and evaporating or sublimating of targets with varying sizes and materials.
Implementation Method 1
a clipping aperture with a clipping opening... for adjusting at least the cross section of the laser beam
Implementation Method 2
a laser light source for providing a laser beam... capable of heating and/or evaporating and/or sublimating a target
Implementation Method 3
laser beam... capable of heating and/or evaporating and/or sublimating a target
Implementation Method 4
heating and/or evaporating and/or sublimating a target
Implementation Method 5
heating and/or evaporating and/or sublimating a target
Data Source
AI summary
The invention relates to a method of running a laser system (10) for providing a laser beam (20) capable of heating and/or evaporating and/or sublimating a target (120) located in a reaction chamber (110) of an evaporation system (100), the laser system (10) comprising a laser light source (12) for providing a laser beam (20), and beam adjusting means (40) for adjusting at least the cross section (22) of the laser beam (20), the beam adjusting means (40) comprising along the laser beam (20) a first adjusting section (42), a clipping aperture (70) with a clipping opening (72) and a second adjusting section (44). Further, the invention relates to a laser system (10) for heating and/or evaporating and/or sublimating a target (120) located in a reaction chamber (110) of an evaporation system (100), the laser system (10) comprising a laser light source (12) for providing a laser beam (20), wherein the laser system (10) comprises beam adjusting means (40) comprising along the laser beam (20) a first adjusting section (42), a clipping aperture (70) with a clipping opening (72) and a second adjusting section (44). Additionally, the invention relates to an evaporation system (100) for coating a substrate (126) with evaporated and/or sublimated material of a source (124), comprising a reaction chamber (110) with a reaction volume (112) for arranging the source (124) and the substrate (126), and a substrate (126) laser system (10) for heating the substrate (126) and/or a source (124) laser system (10) for evaporating and/or sublimating material of the source (124).


