Laser Beam Cutter Layout for Damage-Safe Substrate Lift-Off
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Solution Overview
Problem
The challenge of reliably removing a carrier substrate from a flexible substrate in display device manufacturing using a laser lift-off method without causing damage to the flexible substrate or its components due to improper energy application during the lift-off process.
Innovation Solution
A laser lift-off apparatus and method that utilizes a beam cutter with alternating first and second beam cutters to generate a second beam with varying energy profiles, allowing controlled energy application to different areas of the substrate, ensuring precise lift-off by adjusting energy intensity based on the specific areas of the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform laser beam is used for lift-off, then the process is simple, but damage occurs to the flexible substrate due to excessive energy in certain areas
Solution Approach 1:
The patent applies local quality by creating a non-uniform beam intensity distribution where different regions of the laser beam have different energy levels. The beam is shaped to have a first intensity level for the carrier substrate region and a second, lower intensity level for the flexible substrate region, allowing effective lift-off while preventing substrate damage through localized energy adjustment.
Solution Approach 2:
The patent segments the laser beam into multiple regions with different intensity characteristics. The beam is divided into a first region targeting the carrier substrate and a second region targeting the flexible substrate, with each region having independently controlled energy levels to achieve selective processing without cross-interference.
2Productivity
If high energy laser is applied to ensure complete lift-off, then separation is effective, but components of the display device are damaged
Solution Approach 1:
The patent implements local quality by spatially varying the laser beam intensity to match the different energy requirements of different processing zones. The carrier substrate region receives high energy for effective separation, while the flexible substrate and device components receive reduced energy to prevent damage, achieving both high productivity and component protection simultaneously.
3Device complexity
If uniform energy distribution is used, then the laser system is simple, but precise control over different processing areas is not achieved
Solution Approach 1:
The patent applies parameter changes by modifying the spatial distribution parameters of the laser beam intensity. Through optical elements such as cylindrical lenses or amplitude modulation, the beam parameters are transformed from uniform to non-uniform, creating distinct intensity zones that enable precise energy application to different processing areas while maintaining reasonable system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the reliability of the laser lift-off process by minimizing damage to the display device components while effectively separating the carrier substrate, enhancing the overall manufacturing process.
Implementation Method 1
a laser beam generator configured to generate a first beam
Implementation Method 2
a beam cutter including a first beam cutter and a second beam cutter defining at least two openings having different respective lengths in the first direction, and configured to generate the second beam by transmitting and blocking respective portions of the first beam
Data Source
AI summary
Provided is a laser lift-off apparatus, and a substrate lift-off method using a laser lift-off apparatus. The laser lift-off apparatus is configured to convert a first beam into a second beam having a width in a first direction and in a second direction different from the first direction, the laser lift-off apparatus including a laser beam generator configured to generate the first beam, a homogenizer configured to homogenize the first beam, and a beam cutter including a first beam cutter and a second beam cutter defining at least two openings having different respective lengths in the first direction, and configured to generate the second beam by transmitting and blocking respective portions of the first beam.