Laser Processing Machine Beam Parameter and Diameter Adjustment
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Solution Overview
Problem
Conventional laser processing machines require component replacement to cut both thick and thin plates, leading to increased costs and complexity due to the need for different processing conditions.
Innovation Solution
A laser processing machine equipped with a beam parameter product variable device and a beam diameter variable device, utilizing movable lenses with positive and negative focal lengths to adjust the laser beam parameters and diameter without replacing components, allowing for cutting of plates with varying thicknesses within a predetermined range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If component replacement is performed to cut thick and thin plates, then cutting capability for different plate thicknesses is improved, but device complexity and costs increase
Solution Approach 1:
The patent implements dynamic adjustment of beam parameters through movable lenses (first lens with positive focal length and second lens with negative focal length) that can be positioned at different locations along the optical path. This allows the laser processing machine to adapt to different plate thicknesses by changing the beam diameter and focal position without replacing physical components, thereby resolving the contradiction between versatility and device complexity
Solution Approach 2:
The patent changes optical parameters (beam diameter, focal position, convergence angle) by moving lenses to different positions rather than replacing components. The beam diameter variable device adjusts the beam diameter based on plate thickness requirements, and the focal position variable device adjusts the focal position accordingly, enabling cutting of both thick and thin plates with a single configuration of components
2Adaptability or versatility
If component replacement is performed to cut thick and thin plates, then cutting capability for different plate thicknesses is improved, but costs increase
Solution Approach 1:
The patent creates a universal laser processing machine that can handle both thick plates (6-30mm) and thin plates (0.1-6mm) using the same set of optical components. The beam parameter product variable device and beam diameter variable device enable a single machine configuration to perform multiple cutting tasks across different plate thicknesses, eliminating the need for separate machines or component sets for different plate types, thereby reducing manufacturing costs while maintaining versatility
3Adaptability or versatility
If beam diameter is increased to cut thick plates, then cutting capability for thick plates is improved, but focused beam diameter for thin plates increases reducing cutting precision
Solution Approach 1:
The patent dynamically adjusts the beam diameter incident on the focusing lens based on plate thickness. For thick plates, the beam diameter is increased to provide sufficient energy penetration, while for thin plates, the beam diameter is decreased to maintain precise focal concentration and cutting accuracy. This dynamic adjustment is achieved through the beam diameter variable device with movable lenses that can be repositioned according to the specific cutting requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cutting of plates with a wide range of thicknesses without replacing components, reducing costs and simplifying operations by adjusting beam parameters and diameter to match specific plate thicknesses, thus improving cutting efficiency and surface quality.
Implementation Method 1
a first lens that is movable in an optical axis direction and having a positive focal length, and configured to convert divergent light of a laser beam emitted from an emission end of the laser beam into convergent beam light
Implementation Method 2
a second lens that is movable in the optical axis direction and having a negative focal length on which the convergent light is incident, the second lens is disposed at a position, which is shifted from a position where the convergent light is focused toward the first lens side by the same distance as the focal length of the second lens according to a position of the first lens in the optical axis direction, and is configured to convert the convergent light into parallel light
Implementation Method 3
a third lens having a positive focal length, configured to focus the laser beam emitted from the beam diameter variable device, and to irradiate a plate material with the focused laser beam
Implementation Method 4
a laser processing machine that cuts a plate material formed of metal using a laser beam
Data Source
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AI summary
A laser processing machine includes a beam parameter product variable device (31) configured to vary beam parameter products of a laser beam, and a beam diameter variable device (32) configured to change a beam diameter of the laser beam emitted by the beam parameter product variable device (31). The beam parameter product variable device (31) sets beam parameter products of a laser beam to a predetermined value. The beam diameter variable device (32) includes a first lens (28) that is movable in an optical axis direction and having a positive focal length, and converts divergent light of a laser beam emitted from an emission end of the laser beam into convergent light, and a second lens (30) that is movable in the optical axis direction and having a negative focal length on which the convergent light is incident. A third lens (27) having a positive focal length, focuses the laser beam emitted from the beam diameter variable device (32), and irradiates a plate material with the focused laser beam.