Laser Beam Guide Dynamics for Die Formation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High pulse frequency laser processing technologies face challenges in achieving stable and predictable material removal due to pulse overlap, leading to uneven and unpredictable material interaction with the workpiece surface, especially with current beam guide limitations.
Innovation Solution
Adjusting the web speed of the laser beam to ensure the ratio of web speed to beam diameter and pulse frequency is greater than a specific factor, using a combination of conventional and additional beam guides to create a superimposed movement that minimizes pulse overlap, allowing for precise control of material removal even at high pulse frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high pulse frequency laser processing is used, then productivity increases, but pulse overlap occurs leading to uneven and unpredictable material removal
Solution Approach 1:
The patent applies dynamics by making the beam guide system movable and adjustable. Specifically, the beam guide is designed to superimpose a high-frequency oscillating movement on the laser beam path, which dynamically modifies the beam delivery pattern to prevent pulse overlap while maintaining high pulse frequencies for improved productivity.
Solution Approach 2:
The patent employs mechanical vibration by inducing high-frequency oscillations in the beam guide system. This vibration causes the laser beam to oscillate rapidly, distributing pulses in a more uniform pattern across the workpiece surface, thereby eliminating pulse overlap and ensuring even material removal while maintaining high processing speeds.
2Speed
If beam guide speed is increased, then processing speed improves, but positioning accuracy deteriorates
Solution Approach 1:
The patent applies periodic action by superimposing a high-frequency oscillating movement on the beam guide system. This periodic oscillation allows the beam guide to move rapidly while maintaining precise control over the laser pulse delivery pattern, effectively decoupling the overall scanning speed from the positioning accuracy of individual pulses.
3Productivity
If pulse frequency is increased, then productivity increases, but pulse overlap leads to harmful thermal effects
Solution Approach 1:
The patent uses dynamics by implementing a movable beam guide that superimposes high-frequency oscillations on the laser beam path. This dynamic adjustment ensures that even at high pulse frequencies, pulses are distributed uniformly without overlapping, preventing excessive thermal accumulation and harmful thermal effects on the workpiece.
Solution Approach 2:
The patent employs mechanical vibration through high-frequency oscillations of the beam guide system. This vibration distributes the laser pulses in a dispersed pattern, preventing pulse overlap and the resulting harmful thermal effects, while allowing the use of high pulse frequencies to maintain high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stable and predictable material removal with improved accuracy, reducing pulse overlap and enhancing the precision of die formation and surface treatment, achieving better than 100 μm manufacturing accuracy.
Implementation Method 1
The invention relates to a method and an apparatus for forming a die in a workpiece by means of a pulsating laser beam
Data Source
Figure 1a~1d
Figure 1e~1g
Figure 2~3f
AI summary
A method for forming a die uses a first laser beam guide and a second guide lying in the beam path of the laser beam, which works simultaneously with the first guide and which in turn causes a second laser beam guide with a second orbital velocity that is higher than the first orbital velocity.