Laser Beam Offset Assembly for Tapered Micropore Drilling
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Solution Overview
Problem
Existing laser processing equipment is limited by diffraction characteristics, unable to adjust taper angles of micropores effectively, resulting in inadequate flexibility for manufacturing straight and tapered holes, and has low throughput and limited drilling dimensions, particularly for holes smaller than 50 microns in diameter.
Innovation Solution
A light emitting method and device that utilizes an offset assembly and a control-manipulating mechanism with a programmable logic controller (PLC) to plan and control the displacement path of a light beam, allowing for adjustable taper angles and high-speed offset paths, enabling the creation of holes of various shapes and sizes through the combination of a galvo motor and focusing assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a glass plate or prism-type trepanning module is rotated by a hollow motor, then circular path offsets can be achieved, but the rotational speed is low (less than 4,000 rpm) resulting in low throughput
Solution Approach 1:
The patent replaces the traditional hollow motor mechanical rotation system with an optical beam offset system. Instead of mechanically rotating the entire drilling module at low speeds, the invention uses optical elements (beam offsetter, mirror, lens) to deflect and offset the laser beam path, achieving high-speed positioning without mechanical rotation constraints. This substitution enables throughput improvement by eliminating the mechanical speed bottleneck.
2Adaptability or versatility
If existing laser processing equipment is used, then laser beam processing can be performed, but the taper angles of the micropores cannot be adjusted as desired due to diffraction characteristics
Solution Approach 1:
The patent introduces dynamic adjustability to the laser beam path by incorporating a movable mirror or beam offsetter that can be positioned at different angles and locations. This dynamic element allows the system to adjust the beam's incident angle on the workpiece, thereby controlling the taper angle of the micropores. The dynamic positioning mechanism enables versatile shape control while maintaining manufacturing precision through programmable path planning.
Solution Approach 2:
The invention adds a spatial dimension to beam control by offsetting the laser beam laterally before it reaches the workpiece. By introducing this additional spatial degree of freedom through the beam offsetter and mirror arrangement, the system can create varied micropore shapes and taper angles without being constrained by simple normal incidence drilling.
3Productivity
If the rotational speed of the hollow motor is increased, then throughput can be improved, but the drilling dimensions become limited and holes smaller than 50 microns cannot be manufactured
Solution Approach 1:
The patent replaces the mechanical rotation system with an optical beam positioning system that uses galvanometer mirrors or programmable logic controllers to deflect the laser beam. This substitution eliminates the mechanical inertia and speed limitations, allowing high-speed beam positioning without compromising the ability to create precise small holes. The optical system can rapidly change beam direction while maintaining tight focus for sub-50-micron hole manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the precise and high-speed manufacturing of holes of any shape and size, including those smaller than 50 microns, by arbitrarily adjusting taper angles and achieving high rotational speeds, addressing the limitations of prior art in laser drilling processes.
Implementation Method 1
a beam splitter; a wave plate provided above the beam splitter; and a reflecting mirror provided above the wave plate, wherein the light beam is incident on and reflected by the beam splitter, passes through the wave plate, is reflected by the reflecting mirror, passes through the wave plate once again, and is reflected and outputted by the beam splitter
Implementation Method 2
a wave plate provided above the beam splitter; a reflecting mirror provided above the wave plate, wherein the light beam is incident on and reflected by the beam splitter, passes through the wave plate
Implementation Method 3
a reflecting mirror provided above the wave plate, wherein the light beam is incident on and reflected by the beam splitter, passes through the wave plate, is reflected by the reflecting mirror
Implementation Method 4
passing a light beam through at least one offset assembly and a focusing assembly in sequence
Data Source
AI summary
A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.