Laser Ablation Beam Shaping for Defect-Free Display Separation
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Solution Overview
Problem
Existing display device manufacturing processes face defects such as film delamination and carbonization due to inadequate laser ablation techniques, leading to suboptimal transmittance and increased production costs.
Innovation Solution
A laser ablation device with a semi-super Gaussian profile output light, emitted by a system comprising multiple cylindrical lenses, is used to separate the display panel from the base substrate, achieving an energy intensity of 130 mJ/cm2 to 200 mJ/cm2 and an overlapping rate of at least 66.7%, reducing defects and improving transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser ablation techniques are used to separate the display panel from the base substrate, then the separation process can be completed, but film delamination and carbonization defects occur leading to suboptimal transmittance
Solution Approach 1:
The patent applies parameter changes by optimizing the laser beam profile from a conventional Gaussian distribution to a semi-super Gaussian distribution with specific order parameters (n=2.0 to 2.4). This parameter modification of the light intensity distribution enables uniform energy delivery across the irradiation area, preventing both insufficient ablation and excessive energy concentration that causes carbonization and film delamination, thereby achieving defect-free separation with high transmittance
Solution Approach 2:
The patent employs periodic action through pulsed laser irradiation with controlled pulse width (5 ns to 20 ns) and repetition frequency. This periodic delivery of energy allows the material to respond in controlled intervals, preventing thermal accumulation that leads to carbonization while ensuring complete separation. The pulsed regime enables precise control over the ablation process, avoiding film delamination by allowing heat dissipation between pulses
2Productivity
If conventional laser ablation is used, then the base substrate can be removed, but production costs increase due to defects and rework
Solution Approach 1:
By changing the laser beam profile parameter to semi-super Gaussian distribution, the patent achieves first-quality separation without defects such as carbonization and film delamination. This eliminates the need for rework and reduces waste, directly improving production efficiency while lowering manufacturing costs associated with defect remediation and material waste
3Manufacturing precision
If higher energy intensity is applied to ensure complete separation, then separation effectiveness improves, but carbonization and film delamination occur
Solution Approach 1:
The patent modifies the energy intensity distribution parameter by using semi-super Gaussian profile instead of conventional Gaussian profile. This parameter change creates a more uniform intensity distribution across the beam cross-section, delivering sufficient total energy for complete separation while preventing localized energy concentration that causes carbonization. The modified parameter ensures complete separation without generating harmful carbonization effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces display device defects, enhances transmittance to 79% to 86%, and minimizes production costs by optimizing the laser ablation process.
Implementation Method 1
a laser ablation device includes: a laser irradiation part configured to emit a plurality of solid-state laser beams; an optical system configured to convert the plurality of solid-state laser beams into output light
Data Source
AI summary
A laser ablation device includes: a laser irradiation part to emit a plurality of solid-state laser beams; an optical system to convert the plurality of solid-state laser beams into output light; and a stage to receive an irradiation target to be irradiated with the output light. A minor axis of the output light has a semi-super Gaussian profile of order 2 to order 2.4.


