Laser Beam Shaping for Localized Thermal Processing Control
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Solution Overview
Problem
Existing laser processing methods face limitations in adjusting the local intensity distribution of laser radiation, which restricts precise control over thermal processing of workpieces, as the intensity distribution is often insufficiently and roughly adjusted from outside, typically following a Gaussian distribution.
Innovation Solution
A device and method that allow for locally defined intensity adjustment of laser radiation by incorporating elements in the beam path or activating multiple radiation sources, enabling a tailored intensity distribution on the workpiece surface, achieved through adjustable optics, beam shaping, and independent control of radiation sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the intensity of laser radiation is adjusted from outside using conventional methods, then the laser beam can be applied to the workpiece surface, but the local intensity distribution cannot be precisely controlled and follows only a coarse Gaussian distribution
Solution Approach 1:
The laser beam is divided into multiple individual beams (at least two, preferably at least three, particularly preferably at least six) that can be independently controlled. Each beam can be directed to different focal spots within the processing area, enabling localized intensity adjustment without affecting the entire beam path complexity
Solution Approach 2:
Different regions of the processing area are assigned different intensity levels by controlling individual laser beams or groups of beams independently. This allows precise local intensity distribution control where each region receives the specific intensity required for the desired processing outcome
2Manufacturing precision
If multiple radiation sources are used to achieve locally defined intensity distribution, then precise temperature control on the workpiece surface is enabled, but the device complexity increases
Solution Approach 1:
Multiple radiation sources share common optical elements and control systems where possible, allowing them to perform both individual localized processing and collective uniform processing. The system can dynamically configure the number and arrangement of active radiation sources based on the processing requirements
Solution Approach 2:
The system allows dynamic adjustment of the number, arrangement, and intensity of active radiation sources during processing. Radiation sources can be selectively activated or deactivated based on real-time processing requirements, enabling flexible adaptation without permanent structural changes
3Ease of manufacture
If the intensity distribution of laser radiation is precisely controlled locally, then the desired surface treatment can be achieved with minimal equipment, but the control system becomes more complex
Solution Approach 1:
The system controls intensity distribution by adjusting parameters of existing laser beams (intensity, focal length, beam shape) rather than introducing entirely new control mechanisms. Each laser beam's parameters can be independently modified to achieve the desired intensity profile
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control over the temperature distribution on the workpiece surface, allowing for targeted surface treatment with efficient equipment setup, offering flexible and varied intensity profiles that can be dynamically adjusted during processing.
Implementation Method 1
thermal processing within a processing area on a workpiece surface by means of a laser beam emitted by at least one radiation source
Implementation Method 2
The energy introduced by the laser radiation causes the desired change in the material
Data Source
Figure 1~6
Figure 7~11
Figure 12~15
AI summary
The invention relates to a device and a method for thermal machining in a machining region (1) on a workpiece surface (2) by means of a laser beam (6) emitted by at least one radiation source (5). At least one element (10, 11, 12) is arranged in the beam path of the laser beam (6), between the at least one radiation source (5) and the machining region (1) on the workpiece surface (2), said element being used to modify the intensity of the laser beam (6) in the machining region (1) in a locally defined manner. Alternatively or additionally, the intensity of at least one of the laser beams (6) in the machining region (1) can be modified in a locally defined manner, by means of a defined control of a plurality of radiation sources (5), such that a locally defined distribution of the intensity of the laser beam (6) hitting the workpiece surface (2) can be obtained in the machining region (1).