Ultrashort Laser Beam Splitting for Precise Workpiece Separation
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Solution Overview
Problem
Existing methods for separating workpieces using laser pulses face challenges in precise alignment and positioning, leading to damage and inefficiency, particularly when cutting small structures or traversing longer paths, which can result in overshooting and damage to the workpiece holder.
Innovation Solution
The method involves splitting a laser beam into multiple partial beams using a beam splitter optical unit and focusing them onto a workpiece, with each beam being moved away and back along a separation line by a deflection value less than or equal to the distance between adjacent beams, allowing for precise material ablation and efficient separation without traversing the entire contour.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple partial laser beams are used to ablate material along the separation line, then material ablation efficiency is improved, but alignment precision deteriorates due to the complexity of positioning and aligning the scanner and displacement stage systems
Solution Approach 1:
The laser beam is divided into multiple partial laser beams using a beam splitter optical unit, allowing simultaneous ablation at multiple positions along the separation line. This segmentation approach increases material removal efficiency while the beams are focused onto a fixed focal plane, simplifying alignment requirements compared to scanning systems.
Solution Approach 2:
The patent replaces mechanical scanning and displacement stage systems with a beam splitter optical unit that generates multiple partial beams. This substitution eliminates the complex mechanical alignment and positioning systems, reducing alignment precision issues while maintaining high ablation efficiency.
2Manufacturing precision
If the arrangement of partial laser beams is displaced over the entire breadth of the workpiece to cut chip structures, then complete separation is achieved, but positioning accuracy deteriorates due to small angle deviations causing beams to pass through the chip structure
Solution Approach 1:
The patent replaces mechanical displacement systems with a beam splitter optical unit that creates multiple partial beams focused on a fixed focal plane. This eliminates mechanical positioning errors and angle deviations, ensuring reliable and accurate cutting of chip structures without beams passing through the intended separation line.
Solution Approach 2:
The patent focuses all partial laser beams onto a fixed focal plane, transforming the problem from one requiring precise mechanical displacement in multiple dimensions to one where beams are precisely positioned in a fixed optical plane. This dimensional transformation improves both cutting accuracy and positioning reliability.
3Manufacturing precision
If partial laser beams traverse a path longer than the actual contour to be machined, then complete coverage is achieved, but harmful effects increase due to damage to the workpiece holder
Solution Approach 1:
The patent replaces mechanical scanning systems that require long traversal paths with a beam splitter optical unit that generates multiple partial beams focused on a fixed focal plane. This eliminates the need for long mechanical movements, ensuring complete coverage of the separation line without beams extending beyond the workpiece and damaging the holder.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and efficient separation of workpieces by ensuring that only the required region is ablated, reducing damage and increasing flexibility in processing different geometries, while avoiding unnecessary traversal and complex alignment requirements.
Implementation Method 1
splitting a laser beam into a plurality of partial laser beams by use of a beam splitter optical unit
Implementation Method 2
splitting a laser beam into multiple partial beams using a beam splitter optical unit
Implementation Method 3
Each of the partial laser beams is focused by a focusing optical unit onto a surface and/or into a volume of the workpiece
Implementation Method 4
Each of the partial laser beams is focused by a focusing optical unit
Implementation Method 5
implementing material ablation in the workpiece along the separation line by introducing the ultrashort laser pulses into the workpiece
Implementation Method 6
material ablation in the workpiece being able to be achieved by way of a laser beam impinging on the workpiece, the ablation for example being able to be achieved by sublimation of the material or by fusing
Implementation Method 7
The partial laser beams are repeatedly moved away from an initial position along the separation line by a deflection value and are subsequently moved back along the separation line into the initial position
Data Source
AI summary
A method for separating a workpiece along a separation line by using ultrashort laser pulses of a laser beam includes splitting the laser beam, using a beam splitter optical unit, into a plurality of partial laser beams. Each partial laser beam is focused by a focusing optical unit onto a surface and/or into a volume of the workpiece so that the partial laser beams are arranged next to one another and spaced apart from one another along the separation line. The method further includes implementing material ablation in the workpiece along the separation line by introducing the ultrashort laser pulses into the workpiece. The partial laser beams are repeatedly moved away from an initial position along the separation line by a deflection value and are subsequently moved back into the initial position. The deflection value is less than or equal to a distance between two adjacent partial laser beams.