Laser Beam Splitting for Smooth Severing of Transparent Materials
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Solution Overview
Problem
Existing laser processing methods for transparent materials face challenges in achieving a smooth and stable severing surface with reduced roughness, as the distance between focus elements significantly impacts the quality of the severing surface and edge stability.
Innovation Solution
A method involving a beam splitter to split an input laser beam into multiple partial beams, which are then focused to form multiple focus elements with a specific distance range (at least 3 μm to 70 μm) between adjacent elements, allowing for precise material modifications that enable efficient severing with reduced surface roughness and increased edge stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single focus element is used for laser processing transparent material, then the processing setup is simple, but the severing surface roughness is high and edge stability is poor
Solution Approach 1:
The patent applies segmentation by dividing a single laser beam into multiple partial beams (e.g., 2-10 beams) that are then focused to create multiple focus elements arranged in a specific pattern. This segmentation of the beam allows the creation of multiple modification lines in transparent material, which collectively produce a smoother severing surface and improved edge stability compared to a single focus element, while avoiding the need for complex multiple laser systems.
2Productivity
If the distance between focus elements is reduced to increase material modification density, then etching efficiency improves, but interference effects increase and disrupt processing quality
Solution Approach 1:
The patent applies parameter changes by optimizing the distance between adjacent focus elements to a specific range (3 μm to 70 μm). This parameter optimization balances two competing requirements: maintaining sufficient proximity between focus elements to ensure continuous and efficient etching (improving productivity), while preserving enough separation to avoid optical interference effects that would disrupt processing consistency (maintaining reliability). The specific distance range represents an empirically determined optimal parameter that resolves this contradiction.
3Manufacturing precision
If multiple focus elements are used to improve severing surface quality, then surface roughness decreases, but controlling the distance between elements becomes more difficult
Solution Approach 1:
The patent applies the intermediary principle by introducing a beam splitter as a mediating optical component that systematically divides the input laser beam into multiple partial beams. The beam splitter provides precise and stable spatial separation between the resulting focus elements, eliminating the difficulty of manually controlling distances between multiple independent beams. This intermediary device ensures consistent focus element spacing (3 μm to 70 μm) while enabling the creation of multiple modification lines that improve severing surface quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a low-roughness severing surface and improved edge stability by controlling the distance between focus elements, preventing interference effects and ensuring consistent material modifications, thereby enhancing the ability to etch and sever transparent materials effectively.
Implementation Method 1
splitting an input laser beam into a plurality of partial beams using a beam splitter
Implementation Method 2
focusing the plurality of partial beams coupled out of the beam splitter to form multiple focus elements
Implementation Method 3
subjecting the material of the workpiece to the multiple focus elements for laser processing
Implementation Method 4
The method achieves a low-roughness severing surface and improved edge stability by controlling the distance between focus elements, preventing interference effects and ensuring consistent material modifications
Data Source
AI summary
A method for laser processing a workpiece is provided. The workpiece includes a transparent material. The method includes splitting an input laser beam into a plurality of partial beams using a beam splitter, focusing the plurality of partial beams coupled out of the beam splitter to form multiple focus elements, and subjecting the material of the workpiece to the multiple focus elements for laser processing. A distance between adjacent focus elements is at least 3 μm and/or at most 70 μm.