Laser Beam Splitting for Faster Thick Substrate Slicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current laser slicing technology for thick substrates, such as crystal ingots, is slow and time-consuming, resulting in high material loss and increased costs due to limited growth or extension of laser modified cracks and inefficient processing paths.
Innovation Solution
A laser slicing apparatus comprising a laser module, a focusing lens set with a light splitting element to split the laser beam into multiple focused beams, and a rotating module to adjust the angle of the light splitting element, forming induce lines and modified groups with laser modified cracks to accelerate the slicing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single laser beam is used to sequentially process multiple laser modified tracks, then the laser slicing technology can be implemented, but the processing speed is slow and time-consuming
Solution Approach 1:
The patent divides a single laser beam into multiple parallel laser beams using a light splitting element. This segmentation allows simultaneous processing of multiple laser modified tracks instead of sequential processing, dramatically increasing the laser slicing production rate and reducing processing time from over 10 hours per slice to significantly shorter durations.
Solution Approach 2:
The patent combines multiple laser beams to process multiple tracks simultaneously within the modified layer. By merging the processing capability across multiple beams operating in parallel, the system achieves high-speed laser slicing while maintaining the required precision for forming continuous laser modified cracks through the substrate.
2Reliability
If multiple laser modified tracks are formed with small intervals, then complete crack formation can be achieved, but the processing path becomes complex and time-consuming
Solution Approach 1:
The processing path is segmented into multiple parallel tracks that are processed simultaneously by multiple laser beams. This segmentation approach maintains crack continuity through proper spacing between tracks while avoiding the complexity of sequential processing, as all tracks are formed in parallel during a single pass through the modified layer.
Solution Approach 2:
The patent transitions from one-dimensional sequential processing to two-dimensional parallel processing by arranging multiple laser beams side-by-side. This dimensional change allows simultaneous formation of multiple laser modified tracks across the modified layer, reducing processing complexity while ensuring complete crack formation through appropriate track spacing and alignment.
3Ease of manufacture
If diamond wire saw cutting technology is used to cut thick substrates, then cutting can be achieved, but material loss is high including cutting loss and grinding polishing loss
Solution Approach 1:
The patent replaces the mechanical diamond wire saw cutting system with a laser-based system. Instead of using mechanical abrasion and grinding that cause significant material loss, the laser induces controlled cracks through the substrate by heating and expanding the lattice structure. This substitution eliminates the need for subsequent grinding and polishing operations, dramatically reducing substrate material loss while maintaining effective cutting capability for thick substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus significantly increases the laser slicing production rate and reduces processing time by forming continuous laser modified cracks, thereby minimizing material loss and lowering the cost of substrate processing.
Implementation Method 1
a focusing lens set having a light splitting element to split the laser beam provided by the laser module into a plurality of focused laser beams
Implementation Method 2
the heat energy generated by the single laser beam A1 of the laser module A will expand the lattice at different positions
Implementation Method 3
the heat energy generated by the single laser beam A1 of the laser module A will expand the lattice at different positions of the plurality of laser modified tracks C
Implementation Method 4
a rotating module for rotating the light splitting element of the focusing lens set by a predetermined angle
Implementation Method 5
the plurality of focused laser beams split by the light splitting element of the focusing lens set are used to form a plurality of induce lines having first laser modified cracks
Implementation Method 6
the heat energy generated by the single laser beam A1 of the laser module A will expand the lattice at different positions
Data Source
AI summary
A laser slicing apparatus, in which a laser module provides a laser beam, and a light splitting element of a focusing lens set splits the laser beam into a plurality of focused laser beams to form a plurality of induce lines having first laser modified cracks in a modified layer at a predetermined depth inside a substrate. A rotating module rotates the light splitting element with an angle, and the light splitting element converts the focused laser beams according to this angle to form a plurality of modified groups between the induce lines. Each modified group includes a plurality of modified lines having second laser modified cracks, and the first laser modified cracks and the second laser modified cracks are connected to each other to form a continuous laser modified crack in the modified layer at the predetermined depth inside the substrate, thereby speeding up the laser slicing production.