Laser Beamlet Heating for Uniform Substrate Etching Patterns
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform temperature distribution and line width control during laser-based etching, particularly when using digital micro-mirror devices (DMDs), as they require complex modeling and calculation for arbitrary etching shapes.
Innovation Solution
The method involves splitting a laser beam into multiple beamlets using an optical modulation unit, such as a DMD, to irradiate non-overlapping areas on the substrate, ensuring uniform heating by sequentially irradiating unit areas, thereby achieving uniform cumulative heating across the entire irradiation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a point light source is used to heat a specific area of the substrate, then the heating area can be localized, but a temperature gradient occurs and uniform temperature distribution is not formed
Solution Approach 1:
The laser beam is divided into multiple beamlets that are spatially separated and directed to different regions of the substrate. Each beamlet heats a specific unit area, and by coordinating multiple beamlets, uniform temperature distribution across the entire irradiation area is achieved without the temperature gradient problems associated with point sources
2Adaptability or versatility
If DMD is used to form various irradiation patterns for etching control, then etching shapes can be varied, but optimized shape modeling and calculation are required for each arbitrary etching shape
Solution Approach 1:
The substrate surface is divided into multiple unit areas, each corresponding to a specific beamlet. By controlling which beamlets are activated and their respective powers, different etching patterns can be achieved directly through spatial and power modulation without requiring complex shape modeling and calculations for each pattern
Solution Approach 2:
The system dynamically adjusts the power and activation state of each beamlet based on real-time processing requirements. This dynamic control allows flexible formation of various etching shapes by simply modifying which beamlets are active and their power levels, eliminating the need for pre-calculated optimized shapes for each pattern
3Temperature
If multiple beamlets are used to irradiate different areas, then uniform heating can be achieved, but the beamlets should not overlap or connect to one another
Solution Approach 1:
Each beamlet is assigned to heat a specific unit area with localized power control. The beamlets are positioned to cover different regions without overlap, and each beamlet's power is independently adjusted to ensure uniform temperature distribution across the entire irradiation area while maintaining precise spatial separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for effective substrate processing by uniformly heating arbitrary shapes and ensuring consistent etching, improving the precision and efficiency of pattern formation on substrates.
Implementation Method 1
a heating operation of irradiating a substrate with a laser generated from a laser source and heating the substrate
Implementation Method 2
a laser splitting operation of splitting the laser into a plurality of beamlets using an optical modulation unit
Data Source
AI summary
Disclosed is a method of processing a substrate, the method including: a heating operation of irradiating a substrate with a laser generated from a laser source and heating the substrate, in which the heating operation includes: a laser splitting operation of splitting the laser into a plurality of beamlets using an optical modulation unit; and a laser irradiating operation of irradiating the substrate with the plurality of beamlets, and the plurality of beamlets is emitted so as not to overlap or be connected to one another.