Laser Processing Apparatus With Below-Surface Irradiation
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Solution Overview
Problem
Existing laser processing apparatuses for flexible substrates are inefficient due to the need for large, expensive optical components and increased size, as they require direct laser irradiation from above, which complicates processing and maintenance, and often necessitate additional support structures and steps for substrate handling.
Innovation Solution
A laser processing apparatus with a compact design that uses a combination of movement mechanisms, including reciprocating linear motion and rotation, to irradiate substrates with a linear beam from below, reducing the size and cost of the apparatus while allowing efficient processing of large substrates, and incorporating a stack processing method with an ashing unit for resin removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a linear beam is used to irradiate a large glass substrate, then productivity is improved, but expensive large optical components and higher output laser oscillators are needed
Solution Approach 1:
The patent divides the large glass substrate into multiple processing regions and uses a smaller linear beam to process each region sequentially. This eliminates the need for a single large optical component, as the same optical components are reused multiple times across different regions, reducing overall system cost and complexity while maintaining productivity
Solution Approach 2:
The patent employs periodic reciprocating motion of the linear beam across the substrate surface. The beam moves back and forth in a scanning pattern, periodically irradiating different regions. This periodic action allows complete processing of large substrates using a compact optical system, avoiding the need for expensive large-scale optical components
2Device complexity
If the linear beam length is shortened to reduce apparatus size, then device complexity is reduced, but mechanisms for moving the beam or substrate in X and Y directions are needed
Solution Approach 1:
The patent combines the linear beam generation mechanism with reciprocating movement mechanisms into an integrated system. The optical components, movement mechanisms, and substrate handling are merged into a unified apparatus where the linear beam source moves reciprocally across the substrate, eliminating the need for separate complex handling systems
Solution Approach 2:
The patent introduces dynamic reciprocating motion to the linear beam system. Instead of a static beam, the system dynamically moves the beam back and forth across the substrate in controlled reciprocating cycles. This dynamic approach enables compact apparatus design while maintaining ease of operation through automated motion control
3Ease of manufacture
If laser irradiation is performed from above the substrate, then processing is straightforward, but additional support structures and robust layers are needed
Solution Approach 1:
The patent inverts the conventional laser irradiation approach by performing irradiation from below the substrate rather than from above. The linear beam passes through the substrate from the rear side, eliminating the need for support structures and robust layers that would otherwise be required to protect the front surface during processing
Solution Approach 2:
The patent extracts and eliminates the unnecessary support structures and robust layers from the processing system. By changing the irradiation direction to from-below, the method removes these additional components entirely, simplifying the overall device structure while maintaining processing effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves efficient processing of large substrates with reduced size and cost, improved maintenance, and eliminates the need for additional support structures by using a compact design and irradiating from below, while enabling effective resin removal through the stack processing method.
Implementation Method 1
a laser oscillation unit having a function of emitting laser light
Implementation Method 2
an optical system having a function of shaping the emitted laser light into a linear beam
Implementation Method 3
a first roller unit having a function of moving the object to be processed in a horizontal direction
Implementation Method 4
a second roller unit having a function of moving the object to be processed in a horizontal direction and in a perpendicular direction
Implementation Method 5
a rotation mechanism having a function of rotating the object to be processed around a center axis of the object to be processed
Implementation Method 6
stack processing method with an ashing unit for resin removal
Data Source
AI summary
A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.