Laser-Bonded Glass Package for Thermal Insulation and Hermetic Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing hermetically sealed packages fail to effectively manage thermal energy dissipation, leading to potential damage from heat spikes, especially in bio-implants and electronic components, due to inadequate thermal insulation and rapid heat release.
Innovation Solution
A hermetically sealed package design using thermally insulating substrates with laser bonding lines that form a hermetic seal, distributing components in separate cavities and using insulating media to control heat dissipation, reducing thermal energy release into the environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hermetically sealed packages are used, then hermetic sealing is achieved, but thermal energy dissipation is inadequate leading to heat damage
Solution Approach 1:
The package is divided into multiple cavities separated by partition walls, with each cavity containing separate functional areas. This segmentation prevents thermal energy from one functional area from directly affecting other areas, isolating heat sources and enabling independent thermal management for each component.
Solution Approach 2:
Different regions of the package are assigned different thermal properties. The base substrate and cover substrate are made of thermally insulating materials in regions adjacent to functional areas to reduce heat dissipation, while heat-dissipating structures are provided in specific locations to manage thermal energy where needed.
2Object-affected harmful factors
If thermally insulating materials are used to reduce heat dissipation, then thermal energy release is reduced, but hermetic sealing reliability may be compromised
Solution Approach 1:
The package employs composite material structures combining thermally insulating materials with hermetically sealing materials. The base substrate and cover substrate are made of glass or glass-ceramic materials that provide both thermal insulation and hermetic sealing properties, while heat-dissipating structures made of different materials are integrated to manage thermal energy without compromising the seal.
3Volume of stationary object
If functional areas are placed in close proximity to maximize space utilization, then package volume is reduced, but thermal energy from one area can damage other areas
Solution Approach 1:
The package is divided into multiple cavities separated by partition walls, with each cavity containing separate functional areas. This segmentation prevents thermal energy from one functional area from directly affecting other areas, isolating heat sources while maintaining compact packaging through efficient spatial arrangement of the divided cavities.
4Object-affected harmful factors
If heat-dissipating structures are added to manage thermal energy, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat-dissipating structures are integrated into the existing package structure rather than being added as separate components. The partition walls serving as cavity separators also function as heat-dissipating structures, and the base substrate and cover substrate are designed with thermal management features built-in, combining multiple functions into single structural elements to minimize overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package effectively reduces heat dissipation, preventing temperature peaks that could cause cell damage, allowing for the use of cheaper components with greater error tolerance and maintaining a safer operating environment.
Implementation Method 1
at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another
Implementation Method 2
The at least one laser bonding line has a height perpendicular to its bonding plane
Implementation Method 3
at least one of the base substrate or the cover substrate being in the form of a thermal insulator
Data Source
AI summary
A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.