Laser-Bonded Optical Assemblies Without Adhesive Contamination
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Solution Overview
Problem
Existing optical systems face challenges with adhesive materials used for bonding optical components, as they can degrade or cause contamination, especially in high-power and high-vacuum environments, and are unsuitable for certain operational wavelengths.
Innovation Solution
The use of a pulsed laser to bond optical components by irradiating an interface between them, causing partial melting and creating a permanent, stable bond without the need for adhesives, allowing for the bonding of similar or dissimilar materials with minimal heat-affected zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive materials are used to bond optical components, then bonding is achieved, but degradation and contamination occur especially in high-power and high-vacuum environments
Solution Approach 1:
The patent removes adhesive materials from the bonding process entirely, replacing them with direct laser-induced bonding between optical components. This extraction eliminates the source of contamination while maintaining reliable bonds in high-power and high-vacuum environments.
Solution Approach 2:
The patent replaces the chemical bonding mechanism of adhesives with a physical laser-induced bonding mechanism. The laser energy directly bonds the optical components through localized heating and material interaction, substituting chemical processes with physical processes that do not produce contamination.
2Adaptability or versatility
If adhesive materials are used for bonding, then components are secured, but the bonding is limited in high-power and certain wavelength operations
Solution Approach 1:
The patent changes the bonding mechanism from chemical adhesive bonding to physical laser-induced bonding, enabling the system to operate across a broader range of wavelengths and power levels. The laser bonding process is not constrained by adhesive material properties, allowing operation in high-power and high-vacuum environments where adhesives fail.
3Reliability
If pulsed laser is used to bond components, then permanent stable bonds are achieved, but localized melting occurs
Solution Approach 1:
The patent applies laser energy locally at the bonding interface between optical components, creating permanent bonds only where needed. The localized heating affects only the immediate bonding zone, leaving the rest of the components at ambient temperature, thus achieving permanent bonds with minimal thermal impact.
Solution Approach 2:
The patent uses pulsed laser delivery to bond components, where the laser operates in discrete pulses rather than continuous mode. This periodic action allows brief intervals for heat dissipation between pulses, preventing excessive temperature buildup while accumulating sufficient energy for permanent bonding over multiple pulses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides durable, contamination-free bonds that withstand operational wavelengths and power levels, suitable for high-power and high-vacuum applications, while minimizing mechanical stress on optical components.
Implementation Method 1
bonding the first optically transmissive substrate to the housing component by irradiating a first surface of the first optically transmissive substrate, a second surface of the housing component, or both using one or more passes of a pulsed laser beam
Implementation Method 2
The pulsed laser may generate one or more bonding locations where the components are in relatively close contact with each other, which may secure the components together via partial melting of material at one or more surfaces
Implementation Method 3
a first optically transmissive substrate comprising a first material that is different from a second material of the housing component, and bonding the first optically transmissive substrate to the housing component by irradiating... using one or more passes of a pulsed laser beam that is transmitted through the first optically transmissive substrate
Data Source
AI summary
Methods, apparatuses, devices, and optical components are described. One or more materials used in an optical system may be bonded together using a pulsed laser beam. The bonding process may include transmitting a pulsed laser to irradiate an interface between two components, which may include two optical components or an optical component and a mounting component. The pulsed laser may generate one or more bonding locations where the components are in relatively close contact with each other, which may secure the components together via at least partial melting of material at one or more surfaces of the components. In some examples, the pulsed laser may be scanned over the bonding locations some quantity of times and/or using a pattern to achieve the bond. In some aspects, one or more absorbing layers may be added to the components.