Laser Processing Alignment for Bonded Planar Members
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Solution Overview
Problem
Laser processing of objects with planar members bonded by light-blocking materials, such as metals or resins, faces challenges in aligning processing lines between the members due to the opaque bonding layer, leading to reduced processing quality.
Innovation Solution
A method involving forming a modified region in the first planar member, then creating a processing scar in the bonding layer, and finally aligning with this scar to form a modified region in the second planar member, ensuring accurate alignment despite the bonding layer's light-blocking properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is used to process the second planar member through the bonding layer from the first planar member side, then processing can be performed, but the opaque bonding layer blocks the laser light, making it difficult to irradiate the second planar member effectively
Solution Approach 1:
The patent reverses the processing sequence by first processing the first planar member, then processing the bonding layer to create a processing scar, and finally processing the second planar member from its own side using the scar as an alignment reference. This inversion of the conventional approach eliminates the need for laser light to penetrate the opaque bonding layer, thereby resolving the light blocking issue while maintaining processing efficiency
2Manufacturing precision
If the object is reversed to irradiate the second planar member from the second planar member side, then effective irradiation is achieved, but the processing line in the first planar member becomes less recognizable through the opaque bonding layer, causing misalignment
Solution Approach 1:
The patent applies preliminary action by creating a processing scar in the bonding layer before processing the second planar member. This scar serves as a pre-established alignment reference that is visible from the second planar member side, enabling accurate positioning of the laser irradiation without relying on recognition of the processing line through the opaque bonding layer
Solution Approach 2:
The processing scar acts as an intermediary element between the first planar member's processing line and the second planar member's processing. It provides a visible reference that mediates the alignment process, allowing the operator to accurately position the laser on the second planar member without directly observing the original processing line through the opaque bonding layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method maintains high processing quality by accurately aligning processing lines across both planar members, even when using materials that are difficult to transmit light, thereby preventing quality degradation.
Implementation Method 1
forming a modified region in the first planar member along the line by irradiating the first planar member with laser light along the line
Implementation Method 2
forming a processing scar in the bonding layer along the line by irradiating the bonding layer with laser light along the line
Implementation Method 3
forming a modified region in the second planar member along the line by irradiating the second planar member with laser light along the line
Data Source
AI summary
It comprises a first step of preparing an object; a second step of forming a modified region in a first member along a line by irradiating the first member with laser light while using a front face of the object as a laser light entrance surface; a third step of forming a processing scar in a bonding layer along the line by irradiating the bonding layer with laser light while using the front face as a laser light entrance surface; and a fourth step, after the first to third steps, of forming a modified region in a second member along the line by irradiating the second member with laser light while using a rear face of the object as a laser light entrance surface; the fourth step uses the processing scar as a reference for alignment of a laser light irradiation position with respect to the second member.