Laser Bonding via Black Coating to Reduce Thermal Damage

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Solution Overview

Problem

Conventional bonding methods using semiconductor lasers often reflect energy, leading to thermal deterioration of resin materials due to high energy requirements, causing issues like burn marks, color change, and deformation.

Innovation Solution

A manufacturing method involving forming perforations with protrusions in the first member, allowing the laser to be blocked and converted into heat within the perforation, thereby reducing the energy needed for bonding and minimizing thermal deterioration of the second member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If semiconductor laser irradiation is applied to bond the first member and second member, then bonding is achieved, but the laser energy is easily reflected making energy conversion to heat ineffective and requiring high laser energy which causes thermal deterioration of the resin material

Engineering Contradiction:
Improvebonding strengthVSAvoidthermal deterioration
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

A black coating layer is applied to the second member before laser bonding to pre-establish high laser absorption capability. This preliminary action ensures that when laser energy is applied during bonding, the coated surface efficiently absorbs the energy and converts it to heat, preventing reflection losses and avoiding the need for high laser power that would cause thermal deterioration of the resin material.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If high energy laser is used to ensure effective bonding, then bonding reliability is improved, but the resin material suffers from burn marks, color change, and deformation

Engineering Contradiction:
Improvebonding reliabilityVSAvoidresin material integrity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The black coating layer, which would normally be considered an additional processing step or modification, is actually the key solution that converts the potential harm of high laser energy into a benefit. By introducing this coating, the system can use lower laser energy levels while still achieving reliable bonding, thereby preventing burn marks, color change, and deformation of the resin material.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively inhibits thermal deterioration of the second member by ensuring efficient energy conversion, maintaining the integrity of the resin material during the bonding process.

Implementation Method 1

the black coating layer 22 having a function of absorbing the laser 30

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

the first member nearby the boundary surface is molten, and the first member enters a concave convex part and is fixed

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentEP3184283B1Bonding structure manufacturing method
Publication Date: 2020.10.14 OMRON CORP
  • EP3184283B1 patent drawingFigure 1
  • EP3184283B1 patent drawingFigure 2~3
  • EP3184283B1 patent drawingFigure 4

AI summary

A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.