Semiconductor Laser Bonding Layout for Coherence Reduction
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Solution Overview
Problem
Existing semiconductor laser devices face challenges in reducing coherence due to temperature differences between active layers with different thermal conductivities, leading to increased costs and poor coherence reduction effects.
Innovation Solution
A semiconductor laser device configuration featuring a plate-like semiconductor laser chip with multiple light emitting regions arrayed perpendicularly, a sub-mount, and a heatsink, where treatment regions on the bonding surfaces reduce adhesion of the bonding material, creating varying thermal resistance paths to achieve distinct temperatures for each active layer, thereby generating different wavelengths and reducing coherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple active layers with different specifications are formed on a single substrate to generate laser light with different wavelengths, then coherence reduction effect is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies local quality by providing treatment regions at specific locations on the bonding surfaces of the semiconductor laser chip, sub-mount, and heatsink. These treatment regions create localized differences in thermal resistance without changing the overall structure or requiring multiple active layers with different specifications. The treatment regions are strategically positioned to ensure that each light emitting region experiences a unique thermal environment, thereby generating different wavelengths while maintaining a simple device structure.
2Object-affected harmful factors
If materials with different thermal conductivities are used in the heatsink to create temperature differences, then coherence reduction effect is improved, but manufacturing cost increases
Solution Approach 1:
The patent changes the thermal resistance parameter by introducing treatment regions on the bonding surfaces rather than changing the material composition of the heatsink. The treatment regions modify the thermal properties at specific locations, creating the necessary temperature differences across the array of light emitting regions without requiring expensive multi-material construction. This approach maintains ease of manufacture while achieving the desired coherence reduction effect.
3Object-affected harmful factors
If treatment regions are provided to create temperature differences, then coherence reduction effect is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the bonding surfaces into treatment regions and non-treatment regions. This segmentation allows for controlled thermal resistance variations without requiring complex overall device architecture. The treatment regions are discrete areas on the bonding surfaces of the semiconductor laser chip, sub-mount, and/or heatsink, creating localized thermal modifications that can be implemented through standard manufacturing processes without significantly increasing manufacturing complexity.
4Temperature
If the thermal conductivity at the center side and both end sides are made different, then temperature differences are created, but active layers at the same distance from the center reach the same temperature, reducing coherence reduction effectiveness
Solution Approach 1:
The patent applies asymmetry by providing treatment regions with asymmetric positioning and/or different specifications across the array of light emitting regions. Instead of symmetric treatment at the center and ends, the treatment regions are strategically placed to create unique thermal paths for each light emitting region. This asymmetric configuration ensures that even active layers at the same distance from the center experience different thermal environments, generating different wavelengths and effectively reducing coherence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for an inexpensive and effective reduction in coherence by ensuring temperature variations along the array direction, resulting in efficient wavelength differentiation among active layers.
Implementation Method 1
one or more treatment regions are provided where adhesion of a bonding material used for their bonding is reduced, said one or more treatment regions being placed to define, in the traveling direction, different coverages depending on a position in an array direction of the multiple light emitting regions
Data Source
AI summary
A semiconductor laser device is configured so that, on at least one of the respective opposing surfaces of a semiconductor laser chip and a sub-mount and the respective opposing surfaces of the sub-mount and a heatsink, one or more treatment regions are provided where adhesion of a bonding material or bonding material used for their bonding is reduced, wherein the one or more treatment regions are placed to define, in a traveling direction of light, different coverages depending on a position in an array direction of multiple light emitting regions.