Laser Bonding Head Nozzle for Uniform Substrate Heating
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Solution Overview
Problem
Existing bonding technologies face issues such as contamination, damage, or uneven laser beam transmission due to the use of transparent glass in bonding heads, leading to potential substrate damage and uneven heating.
Innovation Solution
A bonding head design that includes a laser duct and a holding nozzle with a vacuum source, allowing precise substrate positioning and laser beam guidance, featuring a flexible optical element to homogenize laser power and a fluid/pressure source for adjusting focus and cooling, ensuring even heating and protection against overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If transparent glass is used in the bonding head to allow laser beam passage, then laser transmission is enabled, but contamination, damage, or scratching of the glass occurs leading to inhomogeneous laser beam transmission
Solution Approach 1:
The patent introduces a holding nozzle as an intermediary component between the laser source and the substrate. This nozzle is made of laser-transmissive material and contains a through-hole that allows the laser beam to pass through. The holding nozzle serves as a mediator that enables laser transmission while avoiding the problems of direct glass contact with the substrate, thus preventing contamination and damage that lead to inhomogeneous transmission.
2Use of energy by moving object
If transparent glass is used in the bonding head, then laser beam passage is possible, but laser peaks with higher power are irradiated on the chip in the area of the sucking hole causing potential substrate damage
Solution Approach 1:
The holding nozzle acts as an intermediary that distributes the laser beam more evenly across the substrate surface. By positioning the through-hole centrally and controlling its dimensions, the nozzle prevents concentrated laser peaks from directly irradiating specific areas of the chip, thereby reducing the risk of substrate damage while maintaining effective laser transmission for bonding.
3Device complexity
If the bonding head structure is simplified, then device complexity is reduced, but precise substrate positioning and temperature control capabilities are compromised
Solution Approach 1:
The holding nozzle is designed to perform multiple functions simultaneously: it holds the substrate through vacuum suction, transmits the laser beam through its through-hole, and contributes to temperature control. This multi-functional design reduces the need for separate components, thereby simplifying the overall bonding head structure while maintaining precise substrate positioning and temperature control capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides even substrate heating, prevents damage to substrates with uneven shapes, and ensures accurate temperature control, enhancing bonding efficiency and reliability.
Implementation Method 1
The vacuum source is configured to create a vacuum or suction in the laser duct. The holding nozzle is configured to hold the first substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct.
Implementation Method 2
The laser source directs the laser beam through the laser duct towards the laser exit. The laser beam passes through the nozzle duct and is directed towards the first substrate. The bonding material is melted by applying a laser beam to the first substrate.
Implementation Method 3
an optical element that is configured to homogenize the power of the laser beam
Implementation Method 4
a fluid/pressure source that is configured to introduce a pressurized fluid into the second laser duct part
Data Source
AI summary
A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.