Laser Bonding Head With Vacuum Nozzle for Uniform Substrate Heating
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Solution Overview
Problem
Existing bonding technologies face issues such as contamination, damage, or uneven laser beam transmission due to the use of transparent materials like glass in bonding heads, leading to potential damage and non-homogeneous heating of substrates during the bonding process.
Innovation Solution
A bonding head with a laser duct and a holding nozzle that uses a vacuum source for precise substrate positioning, a laser source for heating, and an optical element to homogenize the laser beam, along with a flexible optical element and fluid/pressure control to ensure even heating and substrate alignment, minimizing damage and ensuring uniform bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If transparent glass is used in the bonding head to allow laser beam passage, then laser transmission is enabled, but the glass may be contaminated, damaged or scratched causing non-homogeneous laser transmission and potential substrate damage
Solution Approach 1:
The patent removes the transparent glass component from the bonding head structure entirely. Instead of using glass to transmit the laser beam, the design allows the laser beam to pass through the bonding head housing directly or through laser-transmissive portions of the housing, eliminating the glass element that causes contamination, damage, and non-homogeneous transmission.
Solution Approach 2:
The patent employs a laser-transmissive housing material that can be replaced if damaged, rather than using expensive precision glass that requires meticulous maintenance. The housing serves dual purposes as both structural support and laser transmission medium, simplifying the overall system.
2Use of energy by moving object
If transparent glass is used in the bonding head, then laser beam passage is possible, but the laser peaks having higher power may be irradiated on the chip in the area of the sucking hole causing non-uniform heating
Solution Approach 1:
The patent eliminates the transparent glass component that causes non-uniform laser transmission. By removing the glass and its associated sucking hole structure, the source of non-uniform heating is eliminated, allowing for more homogeneous laser energy distribution across the substrate.
Solution Approach 2:
The patent introduces a laser-transmissive housing or laser-transmissive portion as an intermediary structure that allows uniform laser beam passage without the optical distortions caused by glass. This intermediary structure provides both mechanical support and controlled laser transmission.
3Measurement precision
If vacuum suction is used to hold the substrate, then substrate positioning is achieved, but the transparent glass may be contaminated or damaged
Solution Approach 1:
The patent removes the transparent glass component from the vacuum path. Instead of using glass with vacuum holes, the design employs a laser-transmissive housing or dedicated holding structure that provides vacuum suction without requiring glass, thereby eliminating contamination and damage risks to glass components.
Solution Approach 2:
The patent introduces a laser-transmissive housing or holding structure as an intermediary between the vacuum source and the substrate. This intermediary provides both the vacuum sealing function and laser transmission capability without relying on fragile glass components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable and efficient bonding process that avoids substrate damage and ensures uniform heating, allowing for precise bonding of substrates with varying shapes and sizes, enhancing the bonding quality and efficiency.
Implementation Method 1
A vacuum source is configured to create a vacuum in the laser duct via a vacuum/pressure channel that leads through the main body to a vacuum/pressure port located inside the laser duct
Implementation Method 2
A laser source is configured to emit and guide the laser beam through the laser duct to the laser exit
Implementation Method 3
The bonding tool is irradiated with a laser beam and is configured to absorb the laser energy in order to be heated
Implementation Method 4
The bonding head also includes an optical element that is configured to homogenize the laser beam
Implementation Method 5
The bonding material is melted by applying a laser beam to the first substrate
Data Source
AI summary
A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.