Laser Bonding Substrate Thermal Control for OLED Sealing
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Solution Overview
Problem
The lifespan of organic light-emitting display devices is shortened due to susceptibility to oxidation and moisture, leading to reduced luminous efficiency and deteriorated color quality, and existing sealing processes may not effectively prevent external moisture ingress.
Innovation Solution
A laser irradiation apparatus is used to bond substrates with temperature maintaining members that heat the substrates to a predetermined temperature (80° C. to 100° C.) during laser irradiation, minimizing stress and cracking, and using frits as bonding members to seal the devices without degrading the light-emitting units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser beam is irradiated onto bonding members to seal substrates, then sealing reliability is improved, but stress and cracking occur due to temperature difference between irradiated and non-irradiated portions
Solution Approach 1:
The patent applies parameter changes by controlling the temperature of the substrate to a specific range (50°C to 150°C) before laser irradiation. This temperature parameter modification reduces the thermal stress and prevents cracking during laser bonding, thereby resolving the contradiction between sealing reliability and substrate strength
Solution Approach 2:
The patent implements preliminary action by pre-heating or pre-cooling the substrate to a predetermined temperature before applying the laser beam. This preliminary temperature adjustment prepares the substrate to withstand the thermal shock of laser irradiation, preventing cracking while maintaining effective sealing
2Strength
If high temperature is applied to bond substrates, then bonding strength is improved, but light-emitting units degrade due to excessive heat
Solution Approach 1:
The patent applies parameter changes by precisely controlling the substrate temperature within the range of 50°C to 150°C during laser bonding. This optimized temperature parameter provides sufficient thermal energy for strong bonding while remaining below the degradation threshold of light-emitting units, thus resolving the contradiction between bonding strength and component reliability
Solution Approach 2:
The substrate temperature acts as an intermediary parameter that mediates between the laser energy input and the sensitivity of light-emitting units. By controlling this intermediate temperature parameter, the patent achieves effective bonding transmission while protecting heat-sensitive components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces stress and cracking in the substrates, maintaining the quality of light-emitting units and extending the lifespan of the organic light-emitting display devices by minimizing temperature differences and avoiding degradation during the bonding process.
Implementation Method 1
maintaining the first substrate at a predetermined temperature to reduce stress between a portion of the substrate to which the laser beam is irradiated and a portion to which the laser beam is not irradiated
Implementation Method 2
a laser oscillating member configured to irradiate a laser beam onto the bonding members
Implementation Method 3
irradiating a laser beam onto the bonding members to fuse the bonding members and seal the first substrate and the second substrate
Data Source
AI summary
A laser irradiation apparatus for bonding a first substrate to a second substrate using bonding members and a method of manufacturing a display device using the same, the laser irradiation apparatus including a stage on which the first substrate is mounted, bonding members disposed between the first substrate and the second substrate, a laser oscillating member configured to irradiate a laser beam onto the bonding members, and a temperature maintaining member co-operating with the first substrate to maintain a temperature of the first substrate at a predetermined temperature.