Surface-Emitting Laser Bump Layout for Stable Chip-to-Driver Spacing
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Solution Overview
Problem
Conventional techniques for joining semiconductor devices to boards struggle with maintaining consistent intervals and preventing breakage of semiconductor elements.
Innovation Solution
A surface emitting laser device design featuring an element unit with surface emitting laser elements and a driver unit connected via first and second bumps made of conductive material, where the second bumps are arranged at a higher density to enhance joining strength and reduce interval variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional joining techniques are used to connect semiconductor devices to boards, then joining can be achieved, but variation in interval between the semiconductor device and board increases and breakage occurs
Solution Approach 1:
The joining structure is segmented into multiple bump types: first bumps for electrical connection between laser elements and driver unit, and second bumps for mechanical support between adjacent area and driver unit. This segmentation allows each bump type to specialize in its function, with second bumps providing dense mechanical support to prevent breakage while first bumps handle electrical connections.
Solution Approach 2:
Different regions are assigned different bump densities and functions: the element arrangement area uses first bumps for electrical connection, while the adjacent area uses second bumps at higher density for mechanical support. This local differentiation optimizes both electrical performance and mechanical strength in respective regions.
2Manufacturing precision
If bump density is increased to suppress interval variation, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The bump structure is divided into two distinct types with different functions and densities. Second bumps are arranged at higher density specifically in the adjacent area for mechanical support, while first bumps are sparser in the element arrangement area for electrical connection. This segmentation achieves high precision without uniformly increasing complexity across the entire device.
Solution Approach 2:
High bump density is applied locally only where mechanical support is needed (adjacent area with second bumps), rather than uniformly across the entire device. This localized approach maintains manufacturing precision where critical while minimizing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses breakage of the element unit and maintains consistent intervals between the element and driver units, improving mechanical strength and reducing electrical resistance variation.
Implementation Method 1
each of the plurality of first bumps and the plurality of second bumps contains a conductive material that becomes difficult to be crushed by pressurization
Data Source
AI summary
A main object is to provide a surface emitting laser device capable of suppressing variation in interval between an element unit and a driver unit while suppressing breakage of the element unit. The present technology is a surface emitting laser device (1) including: an element unit (10) including an element arrangement area (EA) in which a plurality of surface emitting laser elements (100) is arranged and an adjacent area (AA) adjacent to the element arrangement area (EA); a driver unit (20) including a driver IC; a plurality of first bumps (BP1) that individually joins each of the plurality of surface emitting laser elements (100) and the driver unit (20); and a plurality of second bumps (BP2) that joins the adjacent area (AA) and the driver unit (20), in which each of the plurality of first bumps (BP1) and the plurality of second bumps (BP2) includes a conductive material that becomes difficult to be crushed by pressurization, and the plurality of second bumps (BP2) is arranged at a higher density than the plurality of first bumps (BP1).