Integrated Laser-Capacitor Substrate to Cut PCB Parasitic Loss
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Solution Overview
Problem
The layout of components on a printed circuit board (PCB) in LiDAR devices introduces significant parasitic resistance and inductance, leading to reduced energy conversion efficiency due to longer traces and increased energy consumption.
Innovation Solution
An integrated apparatus with alternately stacked etching layers and a laser and capacitor on the same substrate, featuring a filling structure with an insulator and metal layer, reduces parasitic inductance and resistance by minimizing interconnection traces and increasing the specific surface area of the capacitor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are laid out on a PCB with traces connecting them, then the device structure is simple and easy to manufacture, but parasitic resistance and inductance increase significantly
Solution Approach 1:
The patent merges the laser and capacitor components onto a single substrate, eliminating the need for separate PCB traces and interconnection structures. This integration directly reduces parasitic resistance and inductance while maintaining manufacturing feasibility through standardized semiconductor fabrication processes.
Solution Approach 2:
The patent transitions from a planar PCB layout to a three-dimensional stacked architecture where the laser and capacitor are positioned at different vertical levels on the substrate. This dimensional change eliminates long trace connections and reduces parasitic effects while preserving ease of manufacture through vertical integration techniques.
2Volume of moving object
If the capacitor has a small surface area, then the device size is reduced, but heat dissipation capability is insufficient
Solution Approach 1:
The patent applies local quality by creating a filling structure with varying radial widths at different etching layers. The capacitor achieves locally optimized surface area distribution, with larger effective area for heat dissipation in specific regions while maintaining compact overall device dimensions through strategic spatial arrangement.
Solution Approach 2:
The patent implements a nested structure where the filling structure is disposed within etching layers of the substrate. This nesting approach allows the capacitor to achieve enhanced surface area for heat dissipation while being contained within the compact substrate volume, effectively solving the heat dissipation vs. device size contradiction.
3Area of stationary object
If the filling structure penetrates the substrate, then the capacitor surface area is increased, but the substrate structure is compromised
Solution Approach 1:
The patent applies partial action by configuring the filling structure to extend into the substrate without fully penetrating it. This partial penetration approach achieves sufficient capacitor surface area for effective heat dissipation while preserving the structural integrity and stability of the substrate, avoiding the complications of complete through-hole penetration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances energy conversion efficiency and facilitates heat dissipation, improving the performance of LiDAR devices by reducing parasitic effects.
Implementation Method 1
The substrate and the filling structure may form a capacitor
Implementation Method 2
This increases a specific surface area of the capacitor, thereby facilitating heat dissipation and reducing a heat loss
Data Source
AI summary
An integrated apparatus includes a substrate, having at least two etching layers that are alternately stacked; and a laser, located on the substrate. At least one filling structure is disposed on a side that is of the substrate and that is away from the laser. The substrate and the filling structure may form a capacitor. The filling structure includes an insulator and a first metal layer. A height of the filling structure is less than a thickness of the substrate.