Laser Cardboard Creasing With Defocused Beam Ablation

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Solution Overview

Problem

Conventional laser-based creasing methods for cardboard are time-consuming and prone to errors due to the need for multiple creasing lines, which increases the risk of cutting through the cardboard during folding.

Innovation Solution

A method and device using an unfocused laser beam with a larger diameter to ablate the cardboard surface along desired folding lines, reducing the number of creasing lines required and minimizing the risk of cutting, with the laser beam moved in patterns such as parallel lines or dashed lines to facilitate efficient folding without visible creases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a focused laser beam is used for creasing cardboard, then the laser can precisely ablate the upper layer, but multiple creasing lines are necessary which increases processing time and risk of cutting through

Engineering Contradiction:
Improveprecision of upper layer ablationVSAvoidcreasing processing time
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent changes the focus parameter of the laser beam from focused (conventional method) to unfocused. This parameter change allows a single broader creasing line to achieve the same ablation effect that previously required multiple narrower lines, reducing processing time while maintaining precision of the crease.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If multiple creasing lines are used to enable sufficient folding, then folding capability is improved, but the risk of accidentally overlapping lines and cutting through the cardboard increases

Engineering Contradiction:
Improvefolding capabilityVSAvoidrisk of cutting through cardboard
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

By changing the laser beam focus parameter to unfocused, the patent creates a single broader creasing line that eliminates the need for multiple lines. This reduces the risk of overlapping lines and accidentally cutting through the cardboard while maintaining sufficient folding capability.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If the laser beam diameter is increased to reduce the number of creasing lines, then productivity improves, but the precision of ablation may be compromised

Engineering Contradiction:
Improvenumber of creasing linesVSAvoidablation precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the focus parameter to unfocused, which naturally increases the beam diameter at the cardboard surface. This single parameter change achieves both goals: broader coverage for fewer lines and maintained ablation precision through controlled unfocused energy distribution.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the time and risk associated with creasing cardboard, allowing for efficient folding with fewer lines, enhancing productivity and ensuring the creases are not visible on the final packaging.

Implementation Method 1

the laser beam is moved over the cardboard along a desired folding line such that an upper layer of the cardboard is ablated without cutting through the cardboard

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20240157480A1Method for processing a cardboard with a laser beam
Publication Date: 2024.05.16 BOBST MEX SA
  • US20240157480A1 patent drawing
  • US20240157480A1 patent drawing

AI summary

A method for processing a cardboard (12) with a laser beam (14) is provided, wherein the laser beam (14) is moved over the cardboard (12) along a desired folding line (24) such that an upper layer of the cardboard (12) is ablated without cutting through the cardboard (12), wherein the laser beam (14) is adjusted such that the laser beam (14) is focused below the cardboard (12). Further, a device (10) for carrying out a method for processing a cardboard (12) with a laser beam (14) is provided.