Laser Separating-Joining of Carrier Bodies for Defect Sorting
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Solution Overview
Problem
Existing mechanical devices for separating and joining carrier bodies are prone to wear, require significant installation space, and have high maintenance costs, with limited precision and accessibility, making it difficult to efficiently sort out defective components.
Innovation Solution
A separating-joining device utilizing a thermal ablation unit and welding unit, equipped with optical sensors and supervision units, performs precise and automated thermal separation and joining of carrier bodies using a single beam unit, allowing for efficient sorting and rejoining of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical separating devices are used to separate carrier body segments, then the separation can be performed mechanically, but the devices are subject to wear, are inaccurate, and are susceptible to breakdown
Solution Approach 1:
The patent replaces mechanical separating devices with a laser-based thermal separation system. The laser beam directly ablates the carrier body material to create separation interfaces, eliminating mechanical contact and wear. This substitution resolves the contradiction by providing a non-contact separation method that is more reliable and less susceptible to breakdown while maintaining simplicity.
Solution Approach 2:
The patent changes the separation mechanism from mechanical force to thermal energy. By using laser-induced heating to melt and ablate the carrier body material, the system transforms the separation process into a thermal phenomenon. This parameter change enables precise, wear-free separation that improves device reliability without increasing complexity.
2Manufacturing precision
If mechanical cutting devices are used to separate defective components, then the components can be separated, but the devices require a large amount of installation space
Solution Approach 1:
The laser-based thermal separation system replaces bulky mechanical cutting devices with a compact optical system. The laser beam can be precisely directed to create separation interfaces anywhere on the carrier body without requiring large mechanical structures. This substitution dramatically reduces installation space while maintaining or improving separation precision.
Solution Approach 2:
The patent transitions from three-dimensional mechanical cutting tools to a focused laser beam that operates in a different dimensional space. The laser can access and separate components in tight spaces that would be inaccessible to mechanical tools, effectively utilizing optical space rather than mechanical space. This enables high-precision separation in minimal installation footprint.
3Productivity
If mechanical devices are used to cut up the carrier body for sorting out defective components, then the separation can be achieved, but the devices have high level of wear and high maintenance expenditure
Solution Approach 1:
The laser thermal separation system replaces mechanical cutting tools that are subject to wear with a non-contact optical process. The laser beam does not wear down, eliminating the need for frequent blade replacement or mechanical component maintenance. This substitution dramatically reduces maintenance expenditure while maintaining high separation efficiency and productivity.
Solution Approach 2:
The laser system performs self-maintenance by not requiring physical contact with the workpiece. Unlike mechanical tools that wear from friction and impact, the laser beam maintains its cutting capability without degradation. The system is inherently maintenance-free regarding the separation mechanism itself, reducing overall maintenance requirements while sustaining high productivity.
4Measurement precision
If mechanical cutting devices are used to separate components arranged close to one another, then the separation can be performed, but the carrier body has only limited accessibility, so the device has limited capability for nondestructive separation
Solution Approach 1:
The laser system replaces mechanical cutting tools with a non-contact beam that can access areas with limited physical accessibility. The laser can be directed precisely at separation interfaces even in tight spaces where mechanical tools cannot reach. This substitution enables high-precision separation of closely spaced components without being constrained by physical accessibility limitations.
Solution Approach 2:
The patent uses the laser beam's ability to travel through air and be precisely focused in three-dimensional space to overcome accessibility constraints. The optical path can reach separation interfaces that are inaccessible to mechanical tools, enabling accurate separation of components arranged close together or in hard-to-reach locations on the carrier body.
5Adaptability or versatility
If mechanical devices are used for sorting out defective components, then the separation can be achieved, but changing over from one punched part to another component requires high level of refitting expenditure
Solution Approach 1:
The laser separation system is universally applicable to different component types and carrier body configurations. The same laser apparatus can separate various materials and geometries by adjusting beam parameters rather than requiring physical refitting. This universality enables high adaptability to different components while minimizing refitting expenditure, as the system is controlled by software parameters rather than mechanical configurations.
Solution Approach 2:
The laser system uses dynamic control of beam parameters (power, pulse duration, focal position, scanning speed) to adapt to different component types. Rather than static mechanical tooling that requires refitting, the laser parameters can be dynamically adjusted via software to optimize separation for any component configuration. This dynamic adaptability eliminates refitting costs while maintaining versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures precise and efficient separation and joining of components with reduced wear, minimal installation space, and low maintenance, enabling smooth operation and stable carrier body assembly.
Implementation Method 1
a thermal ablation unit (20) for thermal separation of the carrier body (10) by means of a beam (21)
Implementation Method 2
the beam (21) of the thermal ablation unit (20) is furthermore at least temporarily pulsed such that the carrier body (10) is thermally separated layer by layer at a separating interface (14, 15)
Implementation Method 3
a welding unit (40) for thermal joining of the carrier body (10) by means of a beam (41)
Data Source
AI summary
A separating-joining device to sort out a defective component from components arranged in a row on a support body. A thermal cutting unit thermally separates the support body. At least one welding unit thermally joins the support body. A cutting control unit being designed to automatically control the thermal cutting unit such that the support body is thermally separated at at least two ascertainable cutting interfaces of the support body via a beam of the cutting unit. At least one conveyor unit for arranging the two cutting interfaces of the two remaining parts of the support body next to each other in order to form a joining interface. A welding control unit to automatically control the welding unit such that the two remaining parts of the support body are joined at the joining interface via a beam of the welding unit.