Laser Carrier Disruption Element for Precision Glass Processing
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Solution Overview
Problem
Laser processing of materials for devices like touch screens and smartphones is challenging due to the risk of damage from high-intensity laser beams, which can harm components during cutting and processing.
Innovation Solution
A method and apparatus that use a transparent material positioned on a carrier with a laser disruption element to optically disrupt the laser beam, preventing it from reaching sufficient intensity to damage the support base, thereby protecting the carrier during laser processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a high intensity laser beam is used for processing transparent materials, then cutting precision and processing speed are improved, but the support base and carrier components may be damaged due to excessive laser intensity
Solution Approach 1:
A laser disruption element is introduced as an intermediary component positioned between the transparent material and the support base. This element selectively disrupts the laser beam transmission, allowing the laser to effectively process the transparent material while preventing excessive intensity from reaching and damaging the support base structure.
Solution Approach 2:
The laser disruption element exhibits spatially varying optical properties, being transparent in regions where laser processing is needed and opaque or disruptive in regions where protection is required. This local differentiation allows simultaneous achievement of precise cutting and carrier protection.
2Productivity
If the laser beam intensity is increased to improve processing efficiency, then productivity is improved, but the risk of damaging the carrier and support base increases
Solution Approach 1:
The laser disruption element serves as a protective intermediary that enables the use of high-intensity laser beams for improved productivity while simultaneously protecting the carrier structure from damage, thus maintaining reliability during high-efficiency processing operations.
Solution Approach 2:
The carrier structure is segmented into functional zones with different optical properties - some regions allow laser transmission for processing while other regions block or disrupt the laser beam to protect structural components, enabling both high productivity and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and safe laser processing of transparent materials without damaging the support base, enabling efficient cutting and perforation while minimizing subsurface damage and debris generation.
Implementation Method 1
The laser disruption element may optically disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base
Data Source
AI summary
Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.