3D IC Metallization via Laser-Activated Non-Metallic Catalyst
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Solution Overview
Problem
Conventional methods for manufacturing three-dimensional integrated circuits face issues such as damage to carrier materials due to metal chelate addition, non-uniform distribution of additives, and the use of hazardous formaldehyde in metallization processes, which affect adhesion and tensile strength, and result in environmental pollution.
Innovation Solution
A method involving a non-metallic light-induced catalyst is added to a thermally stable carrier material, which is irradiated with a laser to form regions with complexation capability, allowing for stable metal complex formation and reduction, thereby improving adhesion and reducing pollution without pre-copper plating, using a solution with metal ions and a reducing agent for electroless copper and nickel plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal chelate is added to carrier material for metallization, then metal plating can be achieved, but the carrier material is damaged and its breaking point and tensile strength are reduced
Solution Approach 1:
The patent extracts and removes metal elements from the carrier material, using only non-metallic elements (boron, silicon, phosphorus) in the carrier while introducing metal ions externally during the electroless plating process. This separation prevents metal contamination of the carrier material while maintaining metallization capability.
Solution Approach 2:
The patent uses laser irradiation as an intermediary to activate non-metallic elements in the carrier material, transforming them into active sites that can catalyze electroless plating. The laser creates a metallization layer without directly adding metal to the carrier, thus avoiding damage while enabling plating.
2Strength
If laser ray energy is increased to improve metal plating adherence, then adhesion improves, but disconnected circuits may be conducted during electroless plating
Solution Approach 1:
The patent changes the parameters of laser irradiation (energy density, duration, wavelength) to optimize the activation of non-metallic elements without causing excessive heating or damage. This controlled parameter adjustment achieves adequate adhesion while preventing circuit shorting.
3Ease of manufacture
If additive is added to plastic material for metallization, then metal plating can proceed, but the additive is not uniformly distributed, affecting adhesion
Solution Approach 1:
The patent replaces mechanical mixing of metal additives with a field-based approach using laser irradiation. The laser activates non-metallic elements already present in the plastic matrix, eliminating the need for physical mixing and ensuring uniform distribution of active sites throughout the material.
4Ease of manufacture
If formaldehyde is used as reducing agent in metallization process, then copper plating can be achieved, but environmental pollution increases
Solution Approach 1:
The patent changes the chemical parameters of the reducing agent from formaldehyde to alternative substances such as hypophosphite, sulfite, or organic compounds. This substitution maintains the reducing capability needed for copper plating while eliminating or reducing harmful environmental effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method maintains the original mechanical performance of the carrier material, enhances adhesion and quality of the integrated circuit, and decreases production costs and pollution, while avoiding the use of hazardous chemicals.
Implementation Method 1
irradiating the surface of the carrier material with a laser ray to form a specific region needing metallization and further comprises transforming a non-metallic light-induced catalyst in the raw material into groups possessing complexation capability
Implementation Method 2
the metal ions possessing the complexation capability react with the catalyst possessing complexation capability on the surface of the plastic to form a stable complex. Thereafter, the complex is reduced to yield a metal core
Implementation Method 3
the complex is reduced to yield a metal core
Implementation Method 4
a small amount of non-metallic light-induced catalyst comprising an alcohol or an aldehyde is added to the carrier material so that the non-metallic light-induced catalyst is transformed into a catalyst structural component having the complexation capability after the laser irradiation
Data Source
AI summary
A method for manufacturing a three-dimensional integrated circuit. The method includes: 1) adding a non-metallic light-induced catalyst including an alcohol and/or an aldehyde to a thermoplastic carrier material, and molding the resulting mixture by an injection molding machine to form a structural component; 2) irradiating a surface of the structural component with a laser ray to form a line pattern thereon; 3) immersing the structural component in a metal ion solution at room temperature for between 5 and 7 minutes; 4) washing the structural component with distilled water, and immersing the structural component in an aqueous solution including a reducing agent for between 5 and 7 minutes to allow the surface of the structural component to form a metal core; and 5) performing electroless copper plating and medium-phosphorus electroless nickel plating on an area comprising the metal core to yield a conductor track.