Circuit Board Cavity Layout for Deep CO2-Laser Recesses
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Solution Overview
Problem
The challenge of forming cavities in circuit boards to accommodate electronic components while maintaining circuit pattern integrity and adjusting cavity depths without damaging surrounding patterns is difficult, leading to issues with component height variation and overall package thickness.
Innovation Solution
A circuit board design featuring alternating protruding and concave parts on the insulating layer surfaces, with controlled height differences and wave-shaped patterns, allowing for precise cavity formation using a CO2 laser, without requiring additional processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If cavities are formed deeper in circuit boards to accommodate electronic components, then the overall thickness of the package can be reduced, but the surrounding circuit patterns may be damaged
Solution Approach 1:
The insulating layer is designed with varying thickness across different regions. The first region has a reduced thickness to enable deeper cavity formation, while the second region maintains a greater thickness to protect circuit patterns. This local differentiation allows deep cavities to be formed without damaging surrounding circuits.
Solution Approach 2:
The insulating layer is divided into multiple regions with different thickness characteristics. The first region (with smaller thickness) is specifically designated for cavity formation, while the second region (with greater thickness) serves as a protective zone for circuit patterns. This segmentation resolves the conflict between deep cavity needs and circuit protection.
2Adaptability or versatility
If the insulating layer thickness is reduced to enable deeper cavity formation, then component placement flexibility improves, but the structural strength and adhesion may be compromised
Solution Approach 1:
Different regions of the insulating layer have different thicknesses optimized for different functions. The first region has reduced thickness for cavity formation flexibility, while the second region has increased thickness for structural strength and adhesion. This local quality differentiation resolves the contradiction between adaptability and strength.
Solution Approach 2:
The solution moves from a uniform thickness approach to a spatially varying thickness approach. By introducing thickness variation across different spatial regions (first region vs. second region), the design achieves both deep cavity capability and structural integrity simultaneously.
3Manufacturing precision
If additional processes are introduced to control cavity depth precisely, then manufacturing precision improves, but device complexity and production time increase
Solution Approach 1:
The insulating layer is pre-formed with different thickness regions before cavity formation. This preliminary thickness differentiation enables precise cavity depth control during the cavity formation process without requiring additional complex process steps. The thickness variation is built-in rather than added through subsequent processes.
Solution Approach 2:
The cavity depth control function is merged with the insulating layer structure design. Instead of using separate control mechanisms or additional processes, the thickness variation of the insulating layer itself serves as the depth control mechanism, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances reliability and rigidity of the package by allowing precise cavity formation and improved adhesion during component mounting, reducing overall thickness and preventing pattern defects.
Implementation Method 1
a cavity is positioned in at least a part of the second insulating layer from the second surface of the second insulating layer... the forming the cavity uses a CO2 laser
Data Source
AI summary
A circuit board according to an embodiment may include a first insulating layer, a first wiring layer that is buried in the first insulating layer, a first via layer that is disposed in the first insulating layer, and a second insulating layer that is disposed on the first insulating layer, and has a first surface which is in contact with the first insulating layer, and a second surface which is opposite to the first surface. In at least a part of the second insulating layer from the second surface of the second insulating layer, a cavity is positioned, and the second insulating layer includes a first part which is a part overlapping the cavity, and a second part which is a part thicker than the first part, and the first part of the second insulating layer includes first protruding parts and first concave parts.