Laser Micro-Processing of Transparent Ceramics Without Cracks

Solution Overview

Problem

Existing micro-processing methods for transparent ceramic materials like glass, quartz, and sapphire face challenges such as crack formation and shape errors during laser processing, limiting the ability to create micro-patterns without damage.

Innovation Solution

A micro-processing device and method using a laser that forms processing holes in a crystallized material by irradiating a laser beam with high energy per unit volume and short pulse width, followed by chemical removal in a reaction solution, allowing for precise control of hole shape and size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If laser processing is used on transparent ceramic materials, then processing capability is improved, but crack formation and shape errors occur

Engineering Contradiction:

Improveprocessing capabilityVSAvoidshape accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-treating the transparent ceramic material surface before laser processing. A slurry containing abrasive particles is applied to the surface, and ultrasonic vibration is used to prepare the surface layer. This preliminary preparation modifies the surface properties to reduce thermal stress during subsequent laser processing, preventing crack formation and improving shape accuracy of processed features.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If laser beam irradiation is used to form processing holes, then processing speed is improved, but crack formation occurs

Engineering Contradiction:

Improveprocessing speedVSAvoidcrack formation

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an intermediary substance - a slurry containing abrasive particles and liquid - between the laser beam and the ceramic material. This slurry layer acts as a mediator that absorbs and distributes the thermal energy from laser irradiation, preventing concentrated heat buildup that causes cracks. The ultrasonic vibration further enhances this effect by continuously renewing the slurry layer and removing processed debris, enabling high-speed processing without crack formation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional laser processing is used on transparent ceramics, then processing capability is improved, but chemical resistance and brittleness cause limitations

Engineering Contradiction:

Improveprocessing capabilityVSAvoidmaterial integrity

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies preliminary action by pre-treating the transparent ceramic material surface before laser processing. A slurry containing abrasive particles is applied to the surface, and ultrasonic vibration is used to prepare the surface layer. This preliminary preparation modifies the surface properties to reduce thermal stress during subsequent laser processing, preventing crack formation and improving shape accuracy of processed features.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary substance - a slurry containing abrasive particles and liquid - between the laser beam and the ceramic material. This slurry layer acts as a mediator that absorbs and distributes the thermal energy from laser irradiation, preventing concentrated heat buildup that causes cracks. The ultrasonic vibration further enhances this effect by continuously renewing the slurry layer and removing processed debris, enabling high-speed processing without crack formation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of extremely narrow holes with fine three-dimensional shapes and a thickness-to-diameter ratio of several times to tens of thousands, while minimizing cracks and damage to the processing object.

Implementation Method 1

a laser beam irradiation unit which forms a processing hole by irradiating a crystallized processing object, through which the laser beam passes, with a laser beam

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

adjusting a shape of the laser beam such that the crystallized processing object is de-crystallized by the laser beam locally irradiated into the processing object

Methodology Applied

Scientific EffectDe-crystallization: Phase Change

Implementation Method 3

a chemical reaction furnace which chemically removes the processing hole, which is formed in a de-crystallized region of the processing object precipitated in a reaction solution accommodated therein, through a chemical reaction

Methodology Applied

Scientific EffectChemical etching: Chemical Bonding

Data Source

PatentUS20250074811A1Micro-processing device and method using laser

Publication Date: 2025.03.06 ITI CO LTD

AI summary

Disclosed are a micro-processing device and method using a laser, the device comprising: a laser beam emission unit for forming a processed hole by emitting a laser beam at a crystallized object to be processed through which the laser beam passes; an optical unit for adjusting the shape of the laser beam so as to locally emit the laser beam at the inside of the object to be processed, thereby de-crystallizing the crystallized object to be processed; a laser beam adjustment unit for adjusting the pulse width and the pulse energy of the laser beam; and a chemical reactor for chemically removing, through a chemical reaction, the processed hole formed in a non-crystallized area of the object to be processed that is precipitated in a reaction solution accommodated inside the chemical reactor.