Laser Processing Chamber Layout for Large Glass Substrates
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Solution Overview
Problem
As the size of glass substrates increases, traditional laser processing methods face challenges in efficiently processing larger substrates due to limitations in moving mechanisms and throughput, leading to increased apparatus complexity and wasteful laser usage.
Innovation Solution
A laser processing apparatus with a control unit that instructs a loading/unloading apparatus to position substrates in specific locations on a stage, allowing for one-directional movement and efficient laser processing without the need for extensive stage movement, thereby simplifying the apparatus and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of glass substrates is increased to process more panels, then the number of panels obtained from one substrate increases, but the complexity of the moving mechanism and apparatus size increases
Solution Approach 1:
The substrate processing is segmented into multiple stationary positions (first position and second position) on the stage. The laser processing apparatus processes different regions of the large substrate at different stationary positions rather than moving the entire apparatus or stage continuously, thereby handling large substrates without increasing moving mechanism complexity.
Solution Approach 2:
The stage is designed to move between discrete stationary positions (first position and second position) rather than continuous movement. This dynamic positioning approach allows the apparatus to handle large substrates efficiently by processing different regions at different positions, improving productivity without requiring complex continuous moving mechanisms.
2Ease of manufacture
If traditional laser processing methods are used for larger substrates, then processing can be performed, but the cycle time increases and throughput decreases
Solution Approach 1:
The substrate is pre-positioned at appropriate locations (first position or second position) on the stage before laser processing begins. This preliminary positioning allows the laser processing to start immediately at the correct regions without time-consuming movement during processing, thereby reducing cycle time while maintaining ease of manufacture for large substrates.
Solution Approach 2:
The laser processing apparatus maintains continuous useful action by processing different regions of the substrate at different stationary positions without interrupting the processing flow. The stage moves between positions and returns efficiently, ensuring that the laser processing continues without unnecessary delays, thus reducing cycle time while preserving manufacturing capability.
3Manufacturing precision
If extensive stage movement is used to process all regions of large substrates, then complete processing is achieved, but the apparatus size and complexity increase
Solution Approach 1:
The solution transitions from one-dimensional continuous stage movement to two-dimensional discrete position processing. By utilizing multiple stationary positions (first position and second position) on the stage in different locations, the apparatus achieves complete processing coverage of large substrates without requiring the stage or apparatus to be excessively large, thereby maintaining manufacturing precision while controlling apparatus size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient processing of larger substrates by reducing apparatus size, improving cycle time, and minimizing wasteful laser shots, while maintaining laser stability and reducing gas consumption.
Implementation Method 1
a laser irradiation unit configured to apply laser light to the object to be processed moving over the top surface
Data Source
AI summary
A laser processing apparatus (1) according to an embodiment includes a processing chamber (18) configured to perform laser processing for an object to be processed (40), a stage (10) disposed inside the processing chamber (18), the stage being configured to convey the object to be processed (40), and a control unit (50) configured to instruct a loading/unloading apparatus (30) about a placement position of the object to be processed (40) over the stage (10), the loading/unloading apparatus (30) being configured to load/unload the object to be processed (40) into/from the processing chamber (18). Further, the processing chamber (18) includes a loading gate (17a) for loading and an unloading gate (17b) for unloading for the object to be processed (40), and the object to be processed (40) is conveyed only in a first direction from the loading gate (17a) toward the unloading gate (17b) over the stage (10).