Laser Annealing Chamber Window Layout for Precise Wafer Positioning

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Solution Overview

Problem

The existing substrate processing apparatuses using laser beam annealing face issues with refractive index changes and shaking of the wafer due to temperature gradients and chamber movement, leading to errors in processing precision.

Innovation Solution

The apparatus incorporates a window portion with two spaced-apart windows and a closed space between them to minimize refractive index changes, and a weight control module to adjust the chamber's center of gravity, reducing shaking and enhancing processing precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single window is used in the chamber, then the structure is simple, but heat transfer to the outside causes refractive index changes in the laser beam path

Engineering Contradiction:

Improvewindow structureVSAvoidprocessing position precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The single window is divided into multiple windows (first window and second window) spaced apart in the first direction. This segmentation creates separate thermal zones and prevents heat from a single large window from causing extensive refractive index changes across the laser beam path, thereby maintaining processing precision while keeping the overall structure relatively simple.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The windows are arranged in the first direction (spatial dimension) rather than stacking them in the optical path direction. This dimensional arrangement allows the laser beam to pass through multiple windows at different positions, distributing the thermal impact across space rather than concentrating it along the beam path, thus reducing refractive index variations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the chamber is moved on the stage for wafer processing, then processing coverage is improved, but shaking occurs due to center of gravity bias

Engineering Contradiction:

Improveprocessing coverageVSAvoidprocessing position precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

A weight control module is introduced to counterbalance the chamber's center of gravity. By positioning weights or adjustable mass elements within the chamber structure, the center of gravity is aligned with the chamber's geometric center, creating a counterbalancing effect that prevents shaking during movement on the stage, thus maintaining processing precision while preserving processing coverage capability.

Inventive Principle:

Principle #8Anti-weight (Counterweight)

3Adaptability or versatility

If structures are attached to the outside of the chamber, then functionality is enhanced, but center of gravity bias increases causing severe shaking

Engineering Contradiction:

Improvechamber functionalityVSAvoidcenter of gravity stability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The weight control module introduces asymmetric weight distribution within the chamber to counterbalance the asymmetric loading from externally attached structures. By strategically placing weights on the opposite side or at different positions inside the chamber, the overall center of gravity is realigned, compensating for the imbalance caused by external attachments and reducing shaking during movement.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures uniform refractive index and minimizes substrate shaking, thereby improving the precision of laser beam processing by maintaining accurate positioning during substrate processing.

Implementation Method 1

a window portion of a chamber may minimize heat transfer to an outside of the window portion by including two windows with a sealed space therebetween

Methodology Applied

Scientific EffectThermal Insulation: Thermal Insulation

Implementation Method 2

an annealing process using a laser beam anneals the wafer in a chamber by transmitting the laser beam through a window of the chamber

Methodology Applied

Scientific EffectLaser: Laser

Implementation Method 3

after ions are implanted into a wafer, annealing is performed to remove deformation caused by ion implantation

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS20250316508A1Substrate processing apparatus

Publication Date: 2025.10.09 SAMSUNG ELECTRONICS CO LTD

AI summary

There is provided a substrate processing apparatus including a chamber including a support portion for supporting a substrate in an internal space and having opening at a one side of the chamber, a window portion provided at the opening, and a laser irradiation device that irradiates the laser beam to the substrate through the window portion. The window portion includes a first window and a second window spaced apart by a gap.