Surface-Emitting Laser Chip Sealing for Stable Auto Power Control
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Solution Overview
Problem
Conventional semiconductor light emitting devices with surface emitting laser chips face challenges in maintaining constant laser light output due to temperature variations, and existing sealing configurations are inefficient in reflecting light for auto power control, leading to potential adhesion of foreign matter and increased manufacturing costs.
Innovation Solution
The semiconductor light emitting device incorporates a surface emitting laser chip, a light receiving chip, and a sealing member with a reflecting portion that reflects a part of the laser light towards the light receiving chip, allowing for effective auto power control and reducing foreign matter adhesion, while simplifying the manufacturing process by integrating the reflecting portion within the sealing member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate reflecting member is used for auto power control, then light reflection efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent integrates the reflecting portion directly into the sealing member, combining two previously separate functions (sealing and light reflection) into a single component. This eliminates the need for a separate reflecting member, thereby reducing device complexity and manufacturing cost while maintaining effective auto power control functionality
2Ease of manufacture
If conventional sealing configurations are used, then manufacturing simplicity is maintained, but light reflection efficiency for auto power control deteriorates
Solution Approach 1:
The sealing member is designed to perform multiple functions simultaneously: it provides sealing protection and incorporates a reflecting portion for light redirection. This multi-functional design maintains manufacturing simplicity while enabling effective auto power control, as the reflecting function is integrated into the existing sealing component rather than requiring additional parts
3Ease of manufacture
If the reflecting portion is integrated into the sealing member, then manufacturing cost is reduced, but the sealing member structure becomes more complex
Solution Approach 1:
By merging the sealing and light reflection functions into a single integrated component, the patent eliminates the need for separate reflecting members, assembly steps, and additional materials. Although the sealing member's structure becomes slightly more complex, the overall device complexity decreases, and manufacturing cost is reduced due to fewer parts and simplified assembly processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent laser light output despite temperature changes, reduces foreign matter adhesion, and lowers manufacturing costs by simplifying the design and integrating the reflecting portion within the sealing member.
Implementation Method 1
a reflecting portion that reflects a part of the laser light toward the light receiving chip
Data Source
AI summary
A surface emitting laser chip includes a first light emitting surface, a second light emitting surface, and a front electrode. The first light emitting surface and the second light emitting surface are formed on a first chip front surface and configured to emit laser light. The front electrode is formed on the first chip front surface and formed at a position separated from each of the first light emitting surface and the second light emitting surface. In plan view, the first light emitting surface and the second light emitting surface are arranged to be separated from each other in an X direction. The surface electrode is arranged between the first light emitting surface and the second light emitting surface in the X direction.