Laser Chip Package Interposer Layout for Dual-Sided Cooling
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Solution Overview
Problem
Current laser chip cooling solutions are limited to single-sided cooling due to wire bonds on the top surface, necessitating high-performance and complex cooling methods like liquid cooling or thermoelectric cooling, which increase costs and complexity.
Innovation Solution
Implementing a dual-sided cooling architecture by replacing wire bonds with a thermally conductive interposer that overhangs the laser chip, allowing for separate thermal coupling to both the top and bottom surfaces, enabling the use of less complex and cost-effective air cooled heatsinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single-sided cooling architecture is used with wire bonds on top surface, then electrical connection is achieved, but cooling performance deteriorates and device complexity increases
Solution Approach 1:
The patent transitions from single-sided cooling to dual-sided cooling by adding a second cooling interface on the top surface of the laser chip. The interposer structure enables thermal coupling on both the bottom surface (through package substrate) and top surface (through interposer), effectively moving from one-dimensional to two-dimensional heat dissipation architecture.
Solution Approach 2:
The interposer serves as an intermediary component between the laser chip and the cooling solutions. It provides thermal coupling to the top surface of the laser chip while allowing electrical connections to be made on its sides, thereby enabling dual-sided cooling without compromising electrical functionality.
2Temperature
If low thermal resistance cooling solution is used for single-sided cooling, then cooling effectiveness is improved, but cost and device complexity increase
Solution Approach 1:
The patent distributes the cooling load across two separate cooling solutions acting on opposite surfaces of the laser chip. Each cooling solution handles approximately half of the thermal management task, allowing the use of simpler, lower-cost cooling components rather than requiring a single high-performance low thermal resistance solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal resistance and lowers laser temperatures while simplifying cooling solutions, making them more efficient and cost-effective compared to single-sided cooling architectures.
Implementation Method 1
an interposer over the laser chip, wherein the interposer overhangs an edge of the laser chip
Implementation Method 2
enabling the use of less complex and cost-effective air cooled heatsinks
Data Source
AI summary
Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.