Dual-Sided Laser Chip Cooling With an Overhanging Interposer
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Solution Overview
Problem
Current laser chip cooling solutions are limited to single-sided cooling due to wire bonds on the top surface, necessitating expensive and complex high-performance cooling methods like thermoelectric or liquid cooling to manage thermal control effectively.
Innovation Solution
Implementing a dual-sided cooling architecture by replacing wire bonds with a thermally conductive interposer that overhangs the laser chip, allowing for thermal coupling to both the top and bottom surfaces, enabling the use of less complex and cost-effective air-cooled heatsinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single-sided cooling architecture is used with wire bonds on top surface, then electrical connection is achieved, but thermal management capability deteriorates requiring expensive cooling solutions
Solution Approach 1:
The patent extracts the electrical connection function from the top surface wire bonds and relocates it to the bottom surface through conductive pillars. This extraction clears the top surface for cooling substrate placement, resolving the contradiction by separating electrical connection (moved to bottom) from thermal management (applied to top surface).
Solution Approach 2:
The patent transitions from single-sided (one-dimensional) cooling to dual-sided (two-dimensional) cooling by adding cooling capability to both top and bottom surfaces. This dimensional expansion allows simultaneous electrical connection and effective thermal management without requiring complex single-sided cooling systems.
2Temperature
If thermoelectric or liquid cooling solutions are used for single-sided cooling, then thermal control is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies cooling to both top and bottom surfaces (excessive action beyond single-sided cooling), which distributes thermal management across two surfaces. This partial application of cooling to each surface reduces the thermal load on individual cooling systems, enabling the use of simpler, less expensive cooling solutions while maintaining effective temperature control.
3Reliability
If wire bonds are placed on top surface for electrical connection, then electrical functionality is achieved, but cooling substrate placement area is reduced
Solution Approach 1:
The patent extracts the electrical connection function from the top surface wire bonds and relocates it to the bottom surface through conductive pillars. This extraction completely clears the top surface for cooling substrate placement, resolving the contradiction by separating electrical connection (moved to bottom) from thermal management (applied to top surface).
Solution Approach 2:
The bottom surface is given dual functionality: it serves both for electrical connection (through conductive pillars) and as a mounting surface for the cooling substrate. This multi-functionality resolves the contradiction by making the bottom surface serve both purposes simultaneously, eliminating the need for wire bonds on the top surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal resistance and lowers costs by allowing dual-sided cooling with air-cooled solutions, achieving effective thermal management with less complex cooling systems.
Implementation Method 1
a thermally conductive interposer that overhangs the laser chip, allowing for thermal coupling to both the top and bottom surfaces
Implementation Method 2
allowing for the use of less complex and cost-effective air-cooled heatsinks
Implementation Method 3
air-cooled heatsinks
Data Source
Figure 1~2A
Figure 2B~3B
Figure 3C~3D
AI summary
Embodiments disclosed herein include dual sided cooling architectures for laser packages. In an embodiment, an electronic package comprises a package substrate, and a laser chip attached to the package substrate. In an embodiment, the laser chip has a first surface and a second surface opposite from the first surface. In an embodiment, an interposer is disposed over the laser chip, where the interposer overhangs an edge of the laser chip. In an embodiment, the electronic package further comprises an interconnect between the interposer and the package substrate.