Laser Chip Heat Sink Interface for Faster Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laser devices face challenges in effectively dissipating the heat generated by light-emitting chips, which can lead to damage due to heat accumulation.
Innovation Solution
The laser device incorporates a heat sink with protrusions and depressions on both the light-emitting chip and the heat sink surfaces, enhancing the contact area and improving heat conduction efficiency through additive and subtractive manufacturing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat sink with flat surfaces is used, then the structure is simple and easy to manufacture, but the contact area between the light-emitting chip and heat sink is insufficient, leading to poor heat dissipation
Solution Approach 1:
The heat sink surface is designed with localized protrusions and depressions rather than uniform modifications. These local structural changes increase the contact area between the light-emitting chip and heat sink specifically at the interface region, improving heat dissipation without requiring complex modifications throughout the entire heat sink structure.
Solution Approach 2:
The invention transitions from a two-dimensional flat contact surface to a three-dimensional surface with protrusions and depressions. This dimensional change creates additional contact points and increases the effective contact area, enabling better thermal coupling between the chip and heat sink while maintaining overall structural simplicity.
2Reliability
If the contact area between light-emitting chip and heat sink is increased through surface modifications, then heat conduction efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The contact surface is segmented into multiple protrusions and depressions rather than using a single complex modified surface. This segmentation allows the structure to be manufactured using standard molding techniques, reducing manufacturing complexity while still achieving increased contact area and improved heat conduction efficiency.
3Temperature
If protrusions and depressions are added to increase contact area, then heat dissipation performance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The invention optimizes the parameters of protrusions and depressions (such as height, width, depth, and spacing) to achieve effective heat dissipation enhancement while maintaining compatibility with standard manufacturing tolerances. By carefully selecting these geometric parameters, the design improves heat dissipation performance without imposing excessively strict precision requirements that would complicate manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases the speed of heat dissipation from the light-emitting chips, preventing damage and enabling efficient operation of the laser device.
Implementation Method 1
The heat sink is located on the bottom plate and in the accommodating space. The light-emitting chip is located on a surface of the heat sink away from the bottom plate... the first surface of the light-emitting chip is in contact with the second surface of the heat sink... enhancing the contact area and improving heat conduction efficiency
Data Source
AI summary
A laser device is provided. The laser device includes a bottom plate, a frame body, a heat sink and a light-emitting chip. The light-emitting chip is located on a surface of the heat sink away from the bottom plate. The light-emitting chip includes a plurality of first protrusions and/or a plurality of first depressions, the plurality of first protrusions and/or the plurality of first depressions are located on a first surface of the light-emitting chip; the heat sink includes a plurality of second depressions and/or a plurality of second protrusions, the plurality of second depressions and/or the plurality of second protrusions are located on a second surface of the heat sink; the plurality of first protrusions are located in the plurality of second depressions, and the plurality of second protrusions are located in the plurality of first depressions.