Semiconductor Laser Chip Assembly With Intermediate Carriers

The patent divides the laser system into separate functional units by mounting each laser diode chip on its own intermediate carrier. This segmentation allows individual chips to be tested, sorted, and replaced independently, so that failure of one chip does not render the entire device unusable. The intermediate carriers act as independent modules that can be managed separately.

The patent enables early testing and sorting of laser diode chips during the mounting process on intermediate carriers. Defective chips can be identified and discarded before final device assembly, while functional chips are retained and mounted on appropriate carriers. This prevents defective chips from being incorporated into the final device and allows recovery of functional chips for use.

The patent introduces an intermediate mounting step on temporary carriers before final device assembly. This preliminary action allows testing and sorting of laser diode chips to be performed early in the production process. Functional chips are identified and selected during this intermediate stage, preventing defective chips from proceeding to final assembly and avoiding waste of functional chips.

The patent uses intermediate carriers as mediator elements between the laser diode chips and the final device structure. These intermediate carriers serve as temporary mounting platforms that enable testing, sorting, and selection of functional chips before the final assembly step. The intermediaries facilitate the sorting process without preventing eventual device assembly.

The patent extracts the substrate from the thermal conduction path between the active region and the intermediate carrier. By removing the substrate from this critical thermal pathway, the design eliminates the thermal resistance introduced by the substrate's low thermal conductivity, allowing heat to flow directly from the active region through the connecting layer to the intermediate carrier with improved efficiency.

The patent creates a thermal conduction pathway that bypasses the substrate by making the active region contact the intermediate carrier directly (or through a thin connecting layer). This alternative thermal pathway copies the mechanical support function while providing superior thermal conduction, effectively replacing the substrate's thermal function with a more efficient material.