Laser Projection Chip Layout for Junction Temperature Control
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Solution Overview
Problem
Laser projection devices face issues with heat dissipation in their light-emitting chips, leading to increased junction temperatures, reduced photoelectric conversion efficiency, and potential thermal damage, due to a regular and compact arrangement of chips that hinders effective heat dissipation in the middle region.
Innovation Solution
The arrangement of light-emitting chips is optimized by reducing the number or density in the middle region and increasing it in the edge region, along with the use of a groove for improved heat dissipation and a polarization conversion component to ensure uniform polarization of laser beams, thereby enhancing heat management and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If light-emitting chips are arranged in a regular and compact array to increase luminance, then the luminance of the laser projection device is improved, but heat dissipation becomes ineffective in the middle region leading to increased junction temperatures
Solution Approach 1:
The patent applies local quality by differentiating the arrangement density of light-emitting chips across different regions of the device. Specifically, the middle region has a reduced number or density of chips compared to edge regions, creating spatially varying heat generation characteristics that enable effective heat dissipation while maintaining overall luminance performance.
2Illumination intensity
If the number of light-emitting chips is increased to improve luminance, then the luminance is improved, but photoelectric conversion efficiency decreases due to thermal effects
Solution Approach 1:
The patent implements local quality by creating region-specific chip arrangements where the middle region has lower chip density. This spatial differentiation reduces thermal accumulation in the center, thereby maintaining photoelectric conversion efficiency while still achieving high overall luminance through increased chip counts in edge regions.
3Volume of moving object
If light-emitting chips are densely packed to reduce device size, then the device compactness is improved, but heat dissipation is hindered leading to potential thermal damage
Solution Approach 1:
The patent applies local quality by implementing non-uniform chip distribution across the device footprint. The middle region features reduced chip density or presence, creating thermal relief zones that facilitate heat dissipation pathways. This regional differentiation maintains device compactness while preventing thermal damage through strategic heat management in critical areas.
4Ease of manufacture
If uniform chip arrangement is used to simplify manufacturing, then manufacturing simplicity is improved, but heat management and image quality are compromised
Solution Approach 1:
The patent implements local quality by transitioning from uniform to non-uniform chip arrangement, specifically reducing chip density in the middle region while maintaining or increasing density at edges. This spatially varying configuration optimizes heat management and image quality while remaining manufacturable through standardized assembly processes adapted to the regional differentiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and luminance of the laser projection device by effectively managing heat and preventing thermal damage, while ensuring consistent color output and reducing the risk of color cast in the projected image.
Implementation Method 1
The operating parameter of each light-emitting chip in the first region is less than an operating parameter of each light-emitting chip in the second region, and the operating parameter includes at least one of a photothermal conversion efficiency or a wavelength of the emitted laser beam
Implementation Method 2
a polarization conversion component to ensure uniform polarization of laser beams
Data Source
AI summary
A laser projection apparatus includes a laser source assembly, a light modulation assembly, and a projection lens. The laser source assembly includes a laser device, and the laser device includes a base plate, at least one frame, and a plurality of light-emitting chips. At least one accommodating space is defined between the at least one frame and the base plate. A region of the base plate located in the at least one accommodating space includes a first region and a second region. The second region is located on at least one side of the first region. An operating parameter of each light-emitting chip in the first region is less than an operating parameter of each light-emitting chip in the second region, and the operating parameter includes at least one of a photothermal conversion efficiency or a wavelength of the emitted laser beam.