Laser Chip-Removal Cutting for PCD and CBN Cutter Finishing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for machining PCD and CBN cutters, such as electric erosion and polishing, are inefficient and produce suboptimal surface finishes, with high material removal rates and environmental concerns, while existing laser machining methods are limited by low efficiency and thermal/mechanical damage.
Innovation Solution
A laser machining method that divides the material to be removed into smaller chips and uses a controlled laser cutting process to efficiently pattern functional portions of PCD or CBN cutters, reducing machining time and waste, and employing a smaller power laser device to enhance efficiency and surface finish.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electric erosion is used to machine PCD or CBN cutters, then material can be removed, but the surface finish quality is poor and cannot achieve the smoothness of polished workpieces
Solution Approach 1:
The patent segments the material removal process into multiple stages with different laser power levels. The first stage uses high power for rapid material removal, while the second stage uses lower power for precision finishing, thereby achieving both high productivity and excellent surface finish quality without requiring post-polishing operations
Solution Approach 2:
The patent changes the laser power parameter dynamically during the machining process. By adjusting the laser power from high to low in successive stages, the process transitions from rapid material removal to precision surface finishing, resolving the contradiction between machining efficiency and surface quality
2Productivity
If conventional laser machining is used, then material can be removed, but thermal and mechanical damage occurs to the workpiece
Solution Approach 1:
The patent employs periodic pulsed laser action instead of continuous laser beam. The intermittent heating allows heat dissipation between pulses, preventing excessive thermal accumulation and mechanical damage while maintaining effective material removal rate through optimized pulse frequency and duration
Solution Approach 2:
The patent uses a moving mirror system to rapidly skip between different machining locations on the workpiece. This allows the laser to process multiple areas in sequence rather than dwelling too long on one spot, reducing thermal accumulation and mechanical damage at any single location while maintaining overall high productivity
3Productivity
If high power laser is used for rapid material removal, then productivity increases, but thermal damage and energy consumption increase
Solution Approach 1:
The patent segments the total energy input into two distinct phases: an initial high-energy phase for rapid material removal, and a subsequent low-energy phase for precision finishing. This segmentation allows the system to achieve high overall productivity while minimizing total energy consumption by using high power only when necessary
Solution Approach 2:
The patent applies excessive (high) laser power only partially during the initial stage of machining when rapid material removal is needed. Once the bulk material is removed, the laser power is reduced to minimal levels for finishing, thereby achieving high productivity during the critical removal phase while keeping overall energy consumption low
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces machining time and environmental impact by efficiently removing material in smaller chips, achieving surface finishes comparable to polishing without thermal or mechanical damage, and lowering production costs through reduced energy consumption.
Implementation Method 1
applying a laser to cut the workpiece along the boundaries to remove orderly each of the plurality of material chips away from the workpiece
Data Source
Figure 1~4
Figure 5~7
Figure 8~10
AI summary
A laser cutting method includes a step of determining a material to be removed (120) and dividing the material to be removed (120) into a plurality of material chips (121) so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed (120) on the workpiece (100) to perform cutting in a first direction and a second direction, such that the material chips (121) can be separated from the workpiece (100) orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips (121) through cutting along the boundary, the pattern on the workpiece (100) is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.