Laser Circumferential Machining for Tangential Workpiece Shaping
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Solution Overview
Problem
Existing laser-based machining methods are unsuitable for efficiently creating an outer workpiece shape that extends over the entire circumference of a workpiece due to time-consuming layer-by-layer material removal, especially when producing items like drills or reamers from cylindrical blanks.
Innovation Solution
A method involving simultaneous superimposed movements of workpiece rotation, laser beam guidance, and feed movement, allowing for the removal of material along the circumference of a workpiece without reclamping, using a laser beam aligned tangentially or nearly tangentially to the workpiece surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If layer-by-layer material removal is used with perpendicular laser beam alignment, then machining precision is maintained, but processing time increases significantly and productivity decreases
Solution Approach 1:
The patent applies dynamics by changing the laser beam alignment from static perpendicular orientation to dynamic tangential orientation that follows the workpiece contour. The laser beam is continuously adjusted to maintain tangential alignment with the workpiece surface during circumferential machining, enabling efficient material removal while maintaining precision through adaptive positioning rather than fixed perpendicular approach
Solution Approach 2:
The patent transitions from two-dimensional layer-by-layer removal (perpendicular to surface) to three-dimensional circumferential machining (tangential along the contour). By aligning the laser beam tangentially to the workpiece surface and moving along the contour path, the process removes material in a single pass around the circumference rather than building removal in successive layers, fundamentally changing the dimensional approach to machining
2Productivity
If the workpiece is rotated and laser beam is guided along the contour, then entire circumferential sections are removed efficiently, but the complexity of coordinating multiple superimposed movements increases
Solution Approach 1:
The patent merges multiple movements into a coordinated system where workpiece rotation, laser beam guidance along the contour, and feed movement are superimposed and synchronized. The control system integrates these movements into a unified operation, where the laser deflection device follows the workpiece contour while the workpiece rotates, creating an efficient circumferential machining process that removes entire sections in one pass
Solution Approach 2:
The patent employs feedback control to coordinate the superimposed movements. The control system monitors the workpiece rotation position and laser beam location, continuously adjusting the laser deflection and feed rate to maintain proper tangential alignment along the contour. This feedback mechanism ensures precise coordination of the complex multi-axis movements without requiring overly complicated mechanical systems
3Ease of manufacture
If perpendicular laser beam alignment is used for material removal, then processing is simple to implement, but it is unsuitable for creating outer workpiece contours that extend over the entire circumference
Solution Approach 1:
The patent transforms the static perpendicular laser alignment into a dynamic tangential alignment system. The laser beam is continuously repositioned to follow the workpiece contour tangentially as the workpiece rotates, enabling the process to adapt to circumferential machining requirements. This dynamic adjustment makes the laser processing suitable for creating outer workpiece contours that extend over the entire circumference, unlike fixed perpendicular alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast and precise machining of workpieces with predetermined outer shapes by removing entire sections along the circumference, eliminating the need for reclamping and reducing processing time.
Implementation Method 1
Laser radiation with a high power density heats the material on the workpiece's surface. The surface of the workpiece reaches such a high local temperature that the material vaporizes or sublimates.
Implementation Method 2
Material removal is also referred to as laser ablation or laser vaporization.
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The invention relates to a method and a device for machining a workpiece (4, 24, 54) on the basis of lasers, wherein a defined outer workpiece shape (21) with a contour (1) is produced on the workpiece (4, 24, 54) by removing material using a laser beam (2, 22, 52), by means of a laser machining device (50) that has a workpiece fixing device (51), which receives and fixes the workpiece (4, 24, 54), a moving device (53), which moves the workpiece fixing device relative to a device base (55), and a laser (56), which generates a laser beam (2, 22, 52) directed along a beam axis (2a, 22a) and has a laser scanning device (57) that deflects the laser beam (2, 22, 52) in a controlled manner. In the process, a movement of the workpiece (4, 24, 34, 54), a guidance of the laser beam (2, 22, 52), and an advancing movement of the workpiece (4, 24, 54) and/or laser beam (2, 22, 52) are carried out in a synchronized manner.