Laser Processing Condition Database for Semiconductor Wafer Cutting
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Solution Overview
Problem
Laser processing workers face difficulties in setting appropriate processing conditions for cutting objects, such as semiconductor wafers, due to varying types and shapes, which require specific irradiation conditions and accumulated processing knowledge.
Innovation Solution
A processing information supply apparatus and system that includes object information input, a processing condition database, and condition setting and output means, allowing workers to input object information and retrieve optimized processing conditions based on stored data, facilitating accurate setting of conditions for laser processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser processing conditions are manually set by workers based on accumulated knowledge, then processing expertise can be applied, but it becomes difficult to appropriately set conditions for individual objects and increases operational complexity
Solution Approach 1:
The system enables automatic setting of processing conditions by the laser processing apparatus itself through database lookup based on object information, eliminating the need for workers to manually retrieve and set conditions from accumulated knowledge, thereby improving reliability while reducing operational complexity
Solution Approach 2:
A processing condition database serves as an intermediary between object information and processing conditions, automatically matching object characteristics with appropriate processing parameters, thus resolving the contradiction between reliable condition setting and ease of operation
2Manufacturing precision
If processing conditions are customized for each object type and shape, then cutting precision is improved, but the time and complexity to set conditions increases
Solution Approach 1:
Processing conditions for various object types and shapes are pre-stored in the database during system setup, allowing rapid retrieval and application during actual processing without requiring time-consuming manual customization, thus maintaining cutting precision while reducing condition setting time
Solution Approach 2:
The processing condition database serves multiple functions by storing conditions for various object types and shapes in a unified structure, enabling the system to handle diverse processing requirements through a single standardized lookup process, thereby achieving both precision and efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables workers to effectively set and apply processing conditions for laser processing, ensuring accurate cutting of objects by providing tailored information based on object type and shape, improving cutting precision and efficiency.
Implementation Method 1
a remarkably high laser light power density is locally obtained at the light-converging point within the object by the laser light being condensed
Implementation Method 2
a modified region is formed within the object to be processed by an absorption phenomenon due to a high power density at the light-converging point within the object
Data Source
AI summary
A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus 10 includes an object information input unit 12 for inputting processing object information on the object to be processed, a processing condition database 19 in which data on processing conditions corresponding to the processing object information is accumulated, a processing condition setting unit 16 for referring to the processing condition data in the database 19 and setting the processing condition for the object based on the processing object information, and a condition information output unit 13 for outputting processing condition information for the set processing condition. Thus, the processing information supply apparatus and the supply system capable of favorably acquiring the processing information applied to the laser processing apparatus at a processing worker side are realized.