Conductive Pattern Formation via Laser-Induced Metal Core
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Solution Overview
Problem
Current methods for forming conductive patterns on polymer resin substrates are complex and inefficient, making it difficult to achieve fine conductive patterns with excellent thermal and mechanical properties.
Innovation Solution
A composition comprising a polymer resin and a non-conductive metal compound with a three-dimensional structure formed by vertex sharing of tetrahedrons, such as CuI, CuCl, or AgI, which forms a metal core upon electromagnetic irradiation, allowing for the formation of a conductive pattern through laser irradiation and subsequent chemical reduction or plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods (photolithography or conductive paste printing) are used to form conductive patterns on polymer resin substrates, then conductive patterns can be formed, but the process becomes too complicated and equipment requirements increase
Solution Approach 1:
The invention extracts and eliminates the complex photolithography and metal layer formation steps from the conventional process. By using a polymer resin composition that directly forms conductive patterns through laser irradiation, the patent removes the need for separate photolithography equipment, metal deposition equipment, and multiple processing steps, achieving significant process simplification
Solution Approach 2:
The invention replaces the mechanical and chemical complex processes of photolithography (photoresist coating, exposure, development, metal deposition) with a direct laser irradiation method. The laser energy directly transforms the polymer resin composition into conductive patterns, substituting multiple mechanical and chemical processes with a single energy-based process
2Manufacturing precision
If conventional methods are used to form conductive patterns, then patterns can be created, but it is difficult to achieve excellent fine conductive patterns with superior thermal and mechanical properties
Solution Approach 1:
The invention changes the physical and chemical parameters of the polymer resin composition to enable direct conductive pattern formation. By adjusting the composition ratios of polymer resin, metal powder, and other components, and controlling laser irradiation parameters (wavelength, power, scanning speed), the process achieves fine pattern formation with excellent thermal and mechanical properties that conventional methods cannot attain
Solution Approach 2:
The invention uses a composite polymer resin composition containing polymer resin, metal powder (0.1-10 wt%), and other additives. This composite material structure enables the material itself to form conductive patterns with superior properties when irradiated by laser, combining the advantages of polymer flexibility with metal conductivity and thermal stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of fine conductive patterns with superior thermal and mechanical stability on polymer resin substrates using a simplified process, suitable for applications like mobile phone cases, RFID tags, and sensors.
Implementation Method 1
the non-conductive metal compound is suitable to form a metal core comprising the Group 11 metal element or an ion thereof by electromagnetic irradiation
Data Source
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AI summary
Provided are a composition for forming a conductive pattern, which enables formation of a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simplified process, a method of forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern includes a polymer resin; and a non-conductive metal compound including a coinage metal element [Group 11 (Group IB)] and a non-metal element, the non-conductive metal compound having a three-dimensional structure formed by vertex sharing of tetrahedrons including the Group 11 metal element, in which a metal core including the Group 11 metal element or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.