Laser Pre-treated Conductive Substrate for High Voltage Bonding
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Solution Overview
Problem
Conventional methods for pre-treating electrically conductive substrates for bonding non-metallic materials, such as etching or abrasive blasting, often fail to provide adequate adhesion and can be hazardous, and are not suitable for high mechanical strain applications like high voltage electrical systems.
Innovation Solution
A method involving laser irradiation to create a micro-structure on the substrate surface with specific I/Ra or I/Rz ratios, which enhances adhesion without using toxic substances and reduces electro-aging effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If etching or abrasive blasting is used to pre-treat the substrate surface, then adhesion in the bonding interface is improved, but toxic substances are required and additional manufacturing steps are needed
Solution Approach 1:
The patent replaces mechanical pre-treatment methods (etching, abrasive blasting) with laser irradiation. The laser creates a micro-structure on the substrate surface through optical energy absorption and localized heating, eliminating the need for mechanical contact and toxic chemicals while achieving comparable or superior adhesion enhancement
Solution Approach 2:
The patent changes the physical state and properties of the substrate surface through laser irradiation parameters (power, pulse duration, scanning speed). By controlling these parameters, the laser creates specific micro-structures with optimized surface area and morphology that enhance adhesion without requiring additional chemical or mechanical processing steps
2Ease of manufacture
If conventional pre-treatment methods are used, then manufacturing process is established, but hazardous substances are used which are harmful to health and environment
Solution Approach 1:
The patent substitutes chemical etching processes with laser irradiation, replacing hazardous chemicals with optical energy. The laser beam interacts with the substrate through absorption and localized heating, creating the desired micro-structure without introducing harmful substances to the manufacturing environment
Solution Approach 2:
The patent converts the potentially harmful concentrated energy of the laser into a beneficial process. The high energy density laser beam, which could cause damage if uncontrolled, is precisely managed to create beneficial micro-structures that enhance bonding while avoiding harmful effects through proper parameter selection
3Strength
If etching or abrasive blasting is used to improve adhesion, then bonding interface strength is enhanced, but the process is complex and costly
Solution Approach 1:
The patent merges multiple functions into the single laser irradiation process. The laser simultaneously cleans the substrate surface, creates micro-structures for mechanical interlocking, and activates surface chemistry for chemical bonding, replacing multiple separate manufacturing steps with one integrated process
Solution Approach 2:
The laser system serves multiple purposes: surface cleaning, micro-structure creation, and adhesion enhancement. This multi-functional approach eliminates the need for separate etching, blasting, and cleaning operations, simplifying the manufacturing process while maintaining or improving bonding interface strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser-induced micro-structure improves the bonding interface's mechanical reliability and reduces electro-aging, enabling reliable operation in high voltage equipment by providing a strong, durable, and environmentally friendly pre-treatment process.
Implementation Method 1
irradiating a surface of the substrate with a laser light from the laser source, thereby forming a micro-structure on the substrate surface
Data Source
AI summary
A method of pre-treating an electrically conductive substrate (12) for bonding a non-metallic material (14) thereon is provided. The method includes: (a) placing the substrate (12) in a laser range of a laser source (16); and (b) irradiating a surface (18) of the substrate (12) with a laser light (24) from the laser source (16), thereby forming a micro-structure (20) on the substrate surface (18). The micro-structure (20) has at least one of: a) an I/Ra ratio of at least 0.2 µm-1, I being the surface index, Ra being the average roughness; or b) an I/Rz ratio of at least 0.03 µm-1, I being the surface index, Rz being the average peak-to-valley distance. An electrically conductive substrate (12), a metal insert (12, 603) for use with a solid insulation component (704, 706, 712, 714), an insulator-conductor assembly (26), and a gas-insulated switchgear station (700) are also provided as well as use of an insulator-conductor assembly (26, 600) in an electrical power system (700).